Multi-feed packaging antenna based on fan-out packaging

Abstract

The invention provides a multi-feed packaging antenna based on fan-out packaging, and relates to the technical field of packaging antennas. According to the invention, the first passivation layer is arranged below the packaging layer, and the first re-wiring layer and the second re-wiring layer are arranged on the first passivation layer to complete the multi-feed packaging antenna structure. Connection ends of a plurality of channels of a chip are connected to an antenna feed structure of a packaged antenna, a metal layer where the antenna feed structure is located is completed by a first rewiring layer in package, and a second rewiring layer is mainly used for realizing the packaged antenna. Due to the fact that a coaxial feed mode is adopted, namely two rewiring layers are used, the multi-port power synthesis function can be achieved on the antenna; meanwhile, the characteristics of loss and small working bandwidth brought by a lossy power synthesizer can be eliminated, the working bandwidth and the beam bandwidth of the antenna are almost as wide as those of a single antenna, and the antenna has the advantages of being simple in structure and convenient to use. Therefore, the size and the cost of the system can be effectively reduced, and the equivalent omnidirectional radiation power of the system is improved.

Description

technical field

[0001] The invention relates to the technical field of packaged antennas, in particular to a fan-out package-based multi-feed packaged antenna. Background technique

[0002] In the millimeter wave or even terahertz frequency band, since the operating wavelength reaches the millimeter or submillimeter level, it is possible to integrate the package antenna and the millimeter wave chip. Antenna-in-Package (AIP) is based on packaging technology and materials, and integrates the millimeter wave chip and antenna in the packaging structure, which can better take into account the size, performance and cost of the antenna, so as to better realize the microsystem Level wireless transmission function.

[0003] Fan-Out Wafer Level Packaging (FOWLP), in the wafer manufacturing process, pulls out the required circuit from the terminal of the semiconductor die to the redistribution layer (Redistribution Layer), and then forms package, the cost is relatively cheap. Existi...

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