High-strength and high-thermal-conductivity polyimide film and preparation method and cutting equipment thereof

A polyimide film, high thermal conductivity technology, used in flat products, other household appliances, applications, etc., can solve the problems of fixed structure, the strength and thermal conductivity of polyimide film cannot meet product requirements, and the quality of use is reduced. , to achieve the effect of convenient cutting

Pending Publication Date: 2021-07-02
常熟市方舟绝缘材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The strength and thermal conductivity of the existing polyimide film cannot meet the product requirements, which reduces the quality of use. At

Method used

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  • High-strength and high-thermal-conductivity polyimide film and preparation method and cutting equipment thereof
  • High-strength and high-thermal-conductivity polyimide film and preparation method and cutting equipment thereof
  • High-strength and high-thermal-conductivity polyimide film and preparation method and cutting equipment thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0036] Example 1

[0037] High intensity high thermally conductive polyimide film, the high-intensity high thermally conductive polyimide film is 65 parts by weight of the following pigmented raw material group: 3, 3 ', 4,4'-biphenyl tetramecate dna 48 of the phenylenediamine, 5.8 pieces of scaly graphic and 3.6 parts of nanocrystalline diamond.

[0038]Preparation method of high-intensity high thermally conductive polyimide film, the preparation method steps are as follows:

[0039] Step 1, the phenylenediamine is dissolved in a polar aprotic solvent, 3, 3 ', 4,4'-biphenyl tetramethylene-p-chipphenic acid dianhydride is added, and the reaction liquid temperature is 26 ° C, 200R / min stirring reaction 2.8h. To obtain a polyamic acid solution;

[0040] Step 2, the scaly graphite and nanocrystalline diamond were added to the polyamic acid, uniformly dispersed, and the solution was vacuum-assisted ultrasonic deproduction, and the delays of the decoined solution casting, re-drying tr...

Example Embodiment

[0042] Example 2

[0043] High intensity high thermally conductive polyimide film, the high-intensity high thermally conductive polyimide film by the following raw material group: 3, 3 ', 4,4'-biphenyl tetramethrhalate 45 parts 42 copies of phenylenediamine, 5.5 parts of scale graphite and 4.2 parts of nanocrystalline diamond.

[0044] Preparation method of high-intensity high thermally conductive polyimide film, the preparation method steps are as follows:

[0045] Step 1, the phenylenediamine is dissolved in a polar aprotic solvent, 3, 3 ', 4,4'-biphenyl tetramethylene four-biphenylene dianhydride is added, and the reaction liquid temperature is 24 ° C, 200R / min stirring reaction 3.5H. To obtain a polyamic acid solution;

[0046] Step 2, the scaly graphite and nanocrystalline diamond were added to the polyamic acid, uniformly dispersed, and the solution was vacuum-assisted ultrasonic deproduction, and the delays of the decoined solution casting, re-drying treatment;

[0047] S...

Example Embodiment

[0048] Example 3

[0049] High intensity high thermally conductive polyimide film, the high-intensity high thermally conductive polyimide film by the following raw material group: 3, 3 ', 4,4'-biphenyl tetramethrhalate 45 parts 42 copies of phenylenediamine, 6.2 parts of scale graphite and 4.8 parts of nanocrystalline diamond.

[0050] Preparation method of high-intensity high thermally conductive polyimide film, the preparation method steps are as follows:

[0051] Step 1, the phenylenediamine is dissolved in a polar aprotic solvent, 3, 3 ', 4,4'-biphenyl tetramethylene four-phenylene dianhydride is added, and the reaction liquid temperature is 18 ° C, 200R / min stirring reaction 3.2h. To obtain a polyamic acid solution;

[0052] Step 2, the scaly graphite and nanocrystalline diamond were added to the polyamic acid, uniformly dispersed, and the solution was vacuum-assisted ultrasonic deproduction, and the delays of the decoined solution casting, re-drying treatment;

[0053] Ste...

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Abstract

The invention discloses a high-strength and high-thermal-conductivity polyimide film and a preparation method and cutting equipment thereof, and relates to the field of polyimide films. The high-strength and high-thermal-conductivity polyimide film comprises the following raw materials in parts by mass: 45-65 parts of 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 32-48 parts of p-phenylenediamine, 5.5-6.2 parts of crystalline flake graphite and 3.6-4.8 parts of nanocrystalline diamond. Through the scheme, 3,3',4,4'-biphenyl tetracarboxylic dianhydride and p-phenylenediamine serve as raw materials of the high-strength and high-thermal-conductivity polyimide film, the crystalline flake graphite and the nanocrystalline diamond are added into the raw materials, when the crystalline flake graphite is added, the crystallinity of the nanocrystalline diamond is reduced, crystallization and activation of the nanocrystalline diamond are facilitated, and the tensile strength is improved; meanwhile, the nanocrystalline diamond is beneficial to improvement of the heat conductivity coefficient of the composite material; in addition, the preparation method is simple, and the production requirements of enterprises are reduced.

Description

technical field [0001] The invention relates to the field of polyimide films, in particular to high-strength and high-thermal-conductivity polyimide films, a preparation method and cutting equipment thereof. Background technique [0002] Polyimide film is one of the earliest products of polyimide, which is used for slot insulation of motors and wrapping materials for cables. Thermoset polyimides have excellent thermal stability, chemical resistance, and mechanical properties, and are typically orange in color. Polyimide film is widely used in the fields of electrical / electronic materials, space / aviation and electrical communication because of its excellent mechanical and thermal dimensional stability and chemical stability. [0003] With the advancement of technology, in some high-end electrical and electrical equipment fields, higher requirements are put forward for the mechanical properties and thermal conductivity of polyimide films. The strength and thermal conductivit...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K3/04C08J5/18C08G73/10B26D1/09B26D5/08B26D7/26B29D7/01
CPCC08J5/18C08G73/1067C08G73/1007B29D7/01B26D1/095B26D5/086B26D7/2628C08J2379/08C08K3/04C08K2201/011C08K2201/014
Inventor 宋丽英方晓栋方晓柯
Owner 常熟市方舟绝缘材料有限责任公司
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