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Thermoplastic polyimide with excellent comprehensive performance and preparation method and application thereof

A polyimide and comprehensive performance technology, which is applied in the field of thermoplastic polyimide and its preparation, can solve the problems such as the difficulty of having both melting processability and heat resistance.

Pending Publication Date: 2021-07-06
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above analysis, the present invention aims to provide a thermoplastic polyimide with excellent comprehensive performance and its preparation method and application to solve the problem of good melting processability and outstanding heat resistance of existing thermoplastic polyimides. Hard to have both

Method used

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  • Thermoplastic polyimide with excellent comprehensive performance and preparation method and application thereof
  • Thermoplastic polyimide with excellent comprehensive performance and preparation method and application thereof
  • Thermoplastic polyimide with excellent comprehensive performance and preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0046] Under nitrogen protection, 189.25g (1.75mol) of m-phenylenediamine (m-PDA), 240.17g (0.75mol) of 4,4'-diamino-2 , 2'-bistrifluoromethylbiphenyl (TFDB) and 4138.07g of N-methylpyrrolidone (NMP), stirred until the diamine was completely dissolved to obtain a homogeneous solution. Then add 1088.39g (2.45mol) of 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) into the homogeneous solution of mixed diamines, and stir the reaction at room temperature until the solution is clear , add the phthalic anhydride (PA) of 14.81g (0.10mol) and the N-methylpyrrolidone (NMP) of 459.79g, obtain the polyamic acid that solid content is 25wt.% after continuing stirring reaction at room temperature for 6 hours resin solution. Add 2476.13g of acetic anhydride and 997.23g of pyridine into the above polyamic acid resin solution, and continue stirring for 14h to carry out chemical imidization reaction to prepare a polyimide resin solution. Transfer the polyimide solution to a plast...

Embodiment 2

[0049] Under nitrogen protection, 162.21g (1.50mol) of m-phenylenediamine (m-PDA) and 264.21g (1.50mol) of 3,5-diaminotrifluorotoluene were sequentially added to a reaction vessel equipped with mechanical stirring and a thermometer (35DBTF) and 3687.98g of N,N-dimethylacetamide (DMAc), stirred until the diamine was completely dissolved to obtain a homogeneous solution. Then add 1319.39g (2.97mol) of 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) into the homogeneous solution of mixed diamines, and stir the reaction at room temperature until the solution is clear , Add 10.37g (0.07mol) of phthalic anhydride (PA) and 409.77g of N,N-dimethylacetamide (DMAc) and continue to stir the reaction at room temperature for 8 hours to obtain a solid content of 30wt.%. Polyamic acid resin solution. 1531.35 g of acetic anhydride and 700.81 g of pyridine were added to the above polyamic acid resin solution, and the stirring was continued for 8 hours to carry out chemical imidiza...

Embodiment 3

[0052] Under nitrogen protection, 162.21g (1.50mol) of m-phenylenediamine (m-PDA) and 264.21g (1.50mol) of 2,5-diaminotrifluorotoluene were sequentially added to a reaction vessel equipped with mechanical stirring and a thermometer (25DBTF) and 3663.15g of N-methylpyrrolidone (NMP), stirred until the diamine was completely dissolved to obtain a homogeneous solution. Then add 1288.30g (2.90mol) of 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) into the homogeneous solution of mixed diamines, and stir the reaction at room temperature until the solution is clear , add the phthalic anhydride (PA) of 29.62g (0.20mol) and the N-methylpyrrolidone (NMP) of 406.85g, obtain the polyamic acid that solid content is 30wt.% after continuing stirring reaction at room temperature for 4 hours resin solution. Add 1531.35g of acetic anhydride and 597.93g of pyridine into the above polyamic acid resin solution, and continue to stir for 12h to carry out chemical imidization reaction ...

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Abstract

The invention relates to thermoplastic polyimide with excellent comprehensive performance and a preparation method and application thereof, belongs to the technical field of polyimide, and solves the problem that good melting manufacturability and high heat resistance of existing thermoplastic polyimide are difficult to achieve at the same time. The thermoplastic polyimide is prepared from the following raw materials: fluorine-containing aromatic dianhydride, m-phenylenediamine, rigid aromatic diamine with a large-volume structure and a non-reactive end-capping reagent. The preparation method comprises the following steps: preparing a polyamide acid solution, preparing a polyimide solution, preparing a polyimide suspension, and carrying out post-treatment to obtain the polyimide powder. The thermoplastic polyimide resin disclosed by the invention can be used as a high-temperature-resistant engineering plastic, composite material matrix resin or a composite material interlayer toughening component, and is applied to the fields of aerospace, automobile manufacturing, power and electric appliances, microelectronics and the like.

Description

technical field [0001] The present invention relates to the technical field of polyimide, in particular to a thermoplastic polyimide with excellent comprehensive performance and its preparation method and application, more specifically to a combination of good melting process performance, outstanding heat resistance and excellent mechanical properties Thermoplastic polyimide and its preparation method and application. Background technique [0002] Due to its outstanding mechanical properties, good heat resistance, high dimensional stability and high creep resistance, thermoplastic polyimide (TPI) is widely used in high-tech industries such as aerospace, automobile manufacturing, electrical appliances and microelectronics. technology field. Although thermoplastic polyimides, which are widely used commercially, have excellent melt processing properties, they exhibit a relatively low glass transition temperature (T g ), it is difficult to meet the requirements of long-term us...

Claims

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Application Information

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IPC IPC(8): C08G73/10
CPCC08G73/1067C08G73/1039C08G73/1007C08G73/1014
Inventor 刘仪范琳许晓洲何民辉莫松
Owner INST OF CHEM CHINESE ACAD OF SCI
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