Welding structure and method of tungsten target material assembly

Abstract

The invention provides a welding structure and method of a tungsten target material assembly. The welding structure comprises an aluminum cover plate, a tungsten target material, an aluminum middle layer and a copper back plate, wherein the copper back plate is provided with a first containing groove, the aluminum middle layer is arranged in the first containing groove and is a first combined part, the aluminum cover plate is provided with a second containing groove, the tungsten target material is arranged in the second containing groove and is a second combined part, the first combined part and the second combined part are stacked, the aluminum middle layer is in contact with the tungsten target material, the contact surface of the tungsten target material and the aluminum middle layer is a first welding surface, a first titanium metal film is arranged on the first welding surface, the surface, in contact with the aluminum middle layer, of the copper back plate is a second welding surface, and a second titanium metal film is arranged on the second welding surface. Degassing, diffusion welding and sheath removal are sequentially conducted on the welding structure, a tungsten target material assembly is obtained, the welding binding rate of the tungsten target material assembly can reach 99% or above under the optimal condition, and safety and stability of follow-up machining are facilitated.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a welding structure of a tungsten target assembly and a welding method thereof. Background technique [0002] Tungsten is a rare metal and an important strategic material. Tungsten targets are mainly used in aerospace, rare earth smelting, electric light source, chemical equipment, medical equipment, metallurgical machinery, smelting equipment, petroleum, and other fields. Because pure tungsten is brittle and difficult to process, most tungsten is alloyed with other metals or is widely used as tungsten compounds. With the rapid development of the electronics industry, the requirements for tungsten targets are also increasing step by step. [0003] Due to the characteristics of the tungsten material and the poor design of the welding structure, in the processing of tungsten targets, welding is prone to poor welding. [0004] CN108247190B discloses a tungsten target diffusion we...

AI Technical Summary

Problems solved by technology

[0003] Due to the characteristics of tungsten material and the poor design of the welding structure, in the processing of tungsten target materials, welding is prone to poor welding

[0004] CN108247190B discloses a tungsten target diffusion welding structure and a tungsten target diffusion welding method, which relate to the technical field of semiconductor sputtering target manufacturing, including a tungsten target body, a copper alloy back plate, a vacuum layer, a first intermediate layer and a second Two intermediate layers; the copper alloy back plate is provided with a placement groove, and the tungsten target body, the vacuum layer, the first intermediate layer and the second intermediate layer are sequentially arranged in the prevention groove and the first intermediate layer is used to release the tungsten target body and copper The stress of the alloy back plate, and the diffusion welding of the copper alloy back plate and the first intermediate layer through the second intermediate layer, and finally prevent the cracking of the tungsten target body during the diffusion welding process through the vacuum layer, but the structure uses more materials , Welding rate is poor

[0005] CN107971620A discloses a tungsten target material diffusion welding method and target material components to alleviate the cracks in the prior art when the tungsten target material is directly welded to the copper alloy back plate, and the tungsten target material and the aluminum intermediate layer, the aluminum intermediate layer Technical problems of difficult diffusion welding with copper alloy

[0006] CN108544045A discloses a tungsten target welding method and a tungsten target assembly. The tungsten target welding method first processes and cleans the tungsten target and the copper back plate before welding. A solder drain piece is placed in the middle of the plate, and then the tungsten target assembly is obtained by brazing the tungsten target and the copper back plate using a brazing process, and the tungsten target assembly is cooled, but there is still a solder joint rate difference problem

Images