A kind of anti-oxidation flux for metal material welding

Abstract

The invention relates to the field of flux, in particular to an anti-oxidation flux for metal material welding, which is prepared from the following raw materials in mass percentage: 0.3-0.5wt% atomized nickel powder, 0.3-0.6wt% rare earth Alloy powder, 3-5wt% cyclohexylamine hydrobromide, 0.5-1wt% acetamide, 5-7wt% graphene oxide, 6-10wt% diluent, 10-20wt% co-solvent, 2 ~5wt% ethyl cellulose, and the balance is bamboo liquefied phenolic resin. The innovative use of bamboo liquefied phenolic resin as the main material, combined with the addition of atomized nickel powder, rare earth alloy powder, cyclohexylamine hydrobromide, acetamide, and graphene oxide, enables the flux to have excellent spreading rate and adhesion Junction, wettability, oxidation resistance, at the same time, it can enhance the strength performance after welding, improve the expansion rate, and the expansion rate can reach more than 90%.

Description

technical field [0001] The invention relates to the field of flux, in particular to an anti-oxidation flux for metal material welding. Background technique [0002] Since the metal surface of the welding material is easily oxidized, it is often necessary to use a large amount of flux to clean the oxide layer and contaminants on the metal surface to increase wetting, help and accelerate the process of welding, thereby improving product reliability. . [0003] At present, the traditional flux is usually a mixture of rosin as the main component. Although this type of flux has good solderability and low cost, it has high residue after soldering, and its residue contains halogen ions, which will gradually cause the electrical insulation performance to decline. To solve this problem, the rosin resin-based flux residue on the electronic printed board must be cleaned, which will not only increase the production cost, but also cause pollution. SUMMARY OF THE INVENTION [0004] Th...

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Problems solved by technology

[0003] At present, the traditional flux is usually a mixture of rosin as the main component. Although this type of flux has good solderability and low cost, it has high residues after soldering. The residues contain halogen ions, which will gradually cause electrical insulation performance to decline. To solve this problem, it is necessary to clean the rosin resin-based flux residues on the electronic printed board, which will not only increase the production cost, but also cause pollution

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