Rosin-based flux for ZnSn-based lead free solder and preparation method thereof

A lead-free solder and rosin-based technology, applied in the field of flux in the welding field, can solve the problems of poor wettability and low solid content, and achieve the effect of strong wetting force, low solid content and high insulation resistance

Inactive Publication Date: 2012-07-18
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to provide a flux with good solderability, low solid content, no corrosion, good electrical insulation performance, and non-toxicity, and to solve the

Method used

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  • Rosin-based flux for ZnSn-based lead free solder and preparation method thereof
  • Rosin-based flux for ZnSn-based lead free solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] At normal temperature, 20g rosin is added into 45g isopropanol and stirred to dissolve, and in another beaker, add 5g organic acid active agent, 1g corrosion inhibitor, 0.1g surfactant and 28.9g isopropanol successively, stir and dissolve The two solutions are mixed, fully stirred and stored at low temperature to obtain 100g of rosin-based flux for ZnSn-based solder;

[0028] Wherein, the composition of organic acid active agent is: 2gL-arginine, 1.5g azelaic acid and 1.5g pimelic acid;

[0029] The composition of the corrosion inhibitor is: 0.5g triethylamine and 0.5g benzotriazole;

[0030] The composition of the surfactant is: 0.05g of OP series surfactants and 0.05g of fluoroaliphatic polyether.

[0031] Compared with the commercially available rosin-based no-clean flux, the density and solid content have decreased by 2.1% and 34.7% respectively, and the spread area and spread rate have increased by 67.1% and 24.1% respectively, so the ZnSn series solder of embodim...

Embodiment 2

[0033] At room temperature, add 40g of rosin to 50g of glycerol and stir to dissolve, then add 1g of organic acid active agent, 0.01g of corrosion inhibitor, 1g of surfactant and 7.99g of glycerin to another beaker, and stir to dissolve Finally, the two solutions are mixed, fully stirred and stored at low temperature to obtain 100g of rosin-based flux for ZnSn-based solder;

[0034] Wherein, the composition of organic acid active agent is: 0.3g succinic acid, 0.4g adipic acid and 0.3g sebacic acid;

[0035] The composition of corrosion inhibitor is: 0.01g triethylamine;

[0036] The composition of the surfactant is: 0.5 g sodium diethyl succinate sulfonate and 0.5 g cetyl trimethyl ammonium bromide.

[0037] Compared with the commercially available rosin-based no-clean flux, the density and solid content have decreased by 1.3% and 21.7% respectively, and the spread area and spread rate have increased by 35.7% and 15.7% respectively, so the ZnSn series solder of embodiment 2 i...

Embodiment 3

[0039] At normal temperature, 30 g of rosin is added to 50 g of ethanol and stirred to dissolve. In another beaker, 3 g of organic acid active agent, 2 g of corrosion inhibitor, 0.5 g of surfactant and 14.5 g of glycerol are added successively. After stirring and dissolving, the The two solutions are mixed, fully stirred and stored at low temperature to obtain 100g of rosin-based flux for ZnSn-based solder;

[0040] Wherein, the composition of organic acid active agent is: 1.5g malic acid and 1.5g succinic acid;

[0041] The corrosion inhibitor consists of: 2g of benzotriazole;

[0042] The composition of the surfactant is: 0.5 g of quaternary ammonium fluoroalkyl compound.

[0043] Compared with the commercially available rosin-based no-cleaning flux, the density and solid content did not change much, and the spreading area and spreading rate increased by 13.7% and 6.6%, respectively.

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Abstract

Rosin-based flux for a ZnSn-based lead free solder comprises rosin, an organic acidity activator, a corrosion inhibitor, a surfactant and an organic solvent. According to the invention, the solder can be additionally provided in injection, spraying or atomization method, the addition amount is easy to accurately control, the disadvantage that the prior soldering flux is hard to brush is overcome, no paste agent, stabilizing agent or thixotropic agent or other substances containing high solid content are included, the solid content of the solder is low, the wetting power to ZnSn-based solder is strong, the residue after welding is little, a metal oxide-film can be effectively removed, the expansion rate is not less than 75%, the effects of film forming and base material protection are possessed, and the preparation method is simple and practicable.

Description

technical field [0001] The invention relates to a flux in the field of welding, in particular to a rosin-based flux for ZnSn lead-free solder and a preparation method thereof. Background technique [0002] ZnSn series solder is a new type of solder that has been developed and developed rapidly in recent years. It has been more and more used in machinery, light industry, instrumentation, electrical machinery, plastics and other industries. Due to the high activity of Zn element and easy oxidation, the corrosion resistance of ZnSn-based solder is poor, and the performance of brazing process is poor. The development of Zn-based solder flux is an effective way to improve ZnSn-based solder. Jiangmen Weisite Welding Material Technology Co., Ltd.’s invention patent No. 200910301960.0 discloses a flux used for brazing metal parts, which consists of hydrofluoric acid, aluminum hydroxide, potassium carbonate, cadmium oxide, cadmium carbonate, oxide Composed of zinc, the flux not only...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 闫焉服陈新芳张继伟盛阳阳王喜然
Owner HENAN UNIV OF SCI & TECH
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