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Adhesive for sealing semiconductor

A semiconductor and glue-using technology, which is applied in the field of semiconductor sealing adhesives, can solve the problems of low viscosity and achieve moderate thixotropic index, good packaging effect and low viscosity

Pending Publication Date: 2021-07-16
苏州科络达信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, through the evolution of semiconductor technology, flip chip technology has progressed to a 3D three-dimensional structure, which puts forward higher requirements for the adhesive used for encapsulation and packaging, requiring lower viscosity, higher thixotropic index, and more Good thermal stability, and requires the material to have good physical properties after curing, but the existing adhesives for semiconductor sealing are difficult to meet the above requirements

Method used

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  • Adhesive for sealing semiconductor
  • Adhesive for sealing semiconductor
  • Adhesive for sealing semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The adhesive for semiconductor sealing in this embodiment is formed by mixing component A and component B with a mass ratio of 1.2:1;

[0034] Component A includes the following raw materials: 68 parts of epoxy resin, 12 parts of thixotropic agent, 2 parts of toughening agent, 5 parts of inorganic filler, and 2 parts of auxiliary agent;

[0035] Component B includes the following raw materials: 45 parts of curing agent and 0.1 part of curing accelerator.

[0036] Wherein, the epoxy resin is composed of bisphenol A type epoxy resin, alicyclic epoxy resin and polyaromatic ring structure epoxy resin with a mass ratio of 1:1:0.5. The thixotropic agent is fumed silica with a particle size of 10 μm. The toughening agent is a mixture of glycol and hydroxyl polybutadiene with a mass ratio of 1:1.2. The inorganic filler is graphite carbon black. The curing agent is a mixture of organosilicon-modified anhydrides and anhydrides with a mass ratio of 1:5. The acid anhydride comp...

Embodiment 2

[0044] The adhesive for semiconductor sealing in this embodiment is formed by mixing component A and component B with a mass ratio of 0.8:1;

[0045] Component A includes the following raw materials: 60 parts of epoxy resin, 10 parts of thixotropic agent, 1 part of toughening agent, 8 parts of inorganic filler, and 1 part of auxiliary agent;

[0046] Component B includes the following raw materials: 40 parts of curing agent and 0.6 parts of curing accelerator.

[0047] Wherein, the epoxy resin is composed of bisphenol A type epoxy resin, alicyclic epoxy resin and polyaromatic ring structure epoxy resin with a mass ratio of 1:2:0.8. The thixotropic agent is fumed silica with a particle size of 7 μm. The toughening agent is a mixture of glycol and hydroxyl polybutadiene with a mass ratio of 1:1. The inorganic filler is graphite carbon black. The curing agent is a mixture of organosilicon-modified anhydrides and anhydrides with a mass ratio of 1:6. Silicone-modified acid anhydr...

Embodiment 3

[0050] The adhesive for semiconductor sealing in this embodiment is formed by mixing component A and component B with a mass ratio of 1:1;

[0051] Component A includes the following raw materials: 76 parts of epoxy resin, 20 parts of thixotropic agent, 2 parts of toughening agent, 10 parts of inorganic filler, and 10 parts of auxiliary agent;

[0052] Component B includes the following raw materials: 52 parts of curing agent and 1.6 parts of curing accelerator.

[0053] Wherein, the epoxy resin is composed of bisphenol A type epoxy resin, alicyclic epoxy resin and polyaromatic ring structure epoxy resin with a mass ratio of 1:0.8:1.4. The thixotropic agent is fumed silica with a particle size of 12 μm. The toughening agent is a mixture of glycol and hydroxyl polybutadiene with a mass ratio of 1:1.5. The inorganic filler is graphite carbon black. The curing agent is a mixture of organosilicon-modified anhydrides and anhydrides with a mass ratio of 1:9. Silicone-modified ac...

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PUM

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Abstract

The invention discloses an adhesive for sealing a semiconductor. The adhesive is prepared by mixing a component A and a component B in a mass ratio of (0.8-1.5):1; the component A comprises the following raw materials in parts by mass: 60-80 parts of epoxy resin, 10-20 parts of a thixotropic agent, 1-3 parts of a flexibilizer, 5-10 parts of an inorganic filler and 1-10 parts of an auxiliary agent; and the component B comprises the following raw materials in parts by mass: 40-60 parts of a curing agent and 0.1-3 parts of a curing accelerator. The adhesive has certain fluidity at normal temperature, is small in viscosity, high in thixotropy and strong in binding power, and also has good mechanical properties, high and low temperature resistance, good insulativity and strong elasticity.

Description

technical field [0001] The invention relates to the technical field of packaging adhesives, in particular to an adhesive for semiconductor sealing. Background technique [0002] The miniaturization of semiconductor components has progressed to 10 nanometer process technology, and the materials for the back-end packaging of active component chips have entered unprecedented challenges. After the early traditional silicon wafers are wire bonded or flip-chip bonded, the common coating technology is encapsulant. This black square encapsulant material is a composite material composed of epoxy resin, ceramic powder, carbon black, etc. Because epoxy resin has the advantages of good connectivity, sealing, electrical insulation, low production cost, and easy processing and molding, it has become one of the main packaging materials. The epoxy resin sealing material is filled in gold wires, copper wires or Between the lead frames, it is responsible for providing insulation. So far, th...

Claims

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Application Information

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IPC IPC(8): C09J163/00C08G59/42C09J11/04C09J11/08
CPCC09J163/00C09J11/08C09J11/04C08G59/423C08G59/4223C08G59/4215C08G59/4207C08L2203/206C08K2201/003C08L47/00C08K7/26C08K3/04
Inventor 谢晓锋
Owner 苏州科络达信息科技有限公司