Buried capacitance circuit board and method of making the same

Abstract

A method for manufacturing an embedded capacitor circuit board, comprising: providing an embedded capacitor substrate, performing a first surface pretreatment on the embedded capacitor substrate and making the first copper foil layer into a first conductive circuit layer; performing the first browning treatment ; Pressing the first copper-clad substrate, the first copper-clad substrate includes the first base material layer and the third copper foil layer; forming the first and second copper-plated layers by electroplating, the first and second copper-plated layers The thickness is equal to the bite amount of the first surface pretreatment and the first browning; the second surface pretreatment is carried out and the second copper plating layer and the second copper foil layer are made into the second conductive circuit layer; the second Second browning treatment; and pressing the second copper-clad substrate, the second copper-clad substrate includes the second base material layer and the fourth copper foil layer, the thickness of the first and second conductive circuit layers is equal, and the second browning The sum of the thicknesses of the treated second copper plating layer and the third copper foil layer is equal to the thickness of the fourth copper foil layer. The manufacturing method can improve the plate warping phenomenon and can improve the success rate of the first piece at one time.

Description

technical field [0001] The invention relates to a multi-layer printed circuit board technology, in particular to a buried capacitance circuit board and a manufacturing method thereof. Background technique [0002] With the development of electronic products in the direction of light, thin, short and small, more and more functions need to be realized, and the usable area of ​​the PCB board is getting smaller and smaller, but there are more and more corresponding electronic components on the PCB, thus giving birth to the PCB products with embedded components. [0003] Embedding capacitors into PCB products requires the use of embedded capacitor substrate materials. Most of the embedded capacitor substrates used as capacitors are high dielectric constant and ultra-thin ceramic materials. The embedded capacitor substrate adopts the traditional double-sided etching method. Due to the ultra-thin and fragile characteristics of the buried capacitance material when making the inner ...

AI Technical Summary

Problems solved by technology

Since desynthesizing, line pre-processing and synthesizing will bite the copper foil layer, the second copper foil layer of the core board of the embedded capacitor substrate will undergo debrowning once more than the first copper foil layer opposite to it. The pre-treatment and browning of the circuit will lead to uneven thickness of the conductive circuit layer on both sides of the core board, which will make it difficult to control the board warpage of this type of product, resulting in a high scrap rate and the first-time success of the first part low rate

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