Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A method and system for preparing a conductive microstructure

A technology of microstructure and current excitation, applied in the direction of copying/marking method, printing post-processing, typewriter, etc., can solve the problems of poor curve effect, difficult preparation, low transparency, etc., to improve transparency, increase seepage channels, and improve transparency Effect

Active Publication Date: 2022-05-06
CHINA AGRI UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a method and system for preparing a conductive microstructure, using multiple current excitation methods, constant temperature curing and sintering technology combined with the self-assembly process of ink droplet particles to form a conductive microstructure with multiple curves and high transparency, to solve the current problem Some multi-curve high-transparency conductive microstructures have the problems of difficult preparation, low transparency and poor curve effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method and system for preparing a conductive microstructure
  • A method and system for preparing a conductive microstructure
  • A method and system for preparing a conductive microstructure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] Such as figure 1 As shown, the present embodiment 1 provides a method for preparing a conductive microstructure, specifically comprising the following steps:

[0068] S1. Pretreat the ink and substrate, and set the inkjet printing parameters of the printing device; specifically include:

[0069] S11, performing ultrasonic vibration treatment on the ink in an ultrasonic cleaning machine;

[0070] S12, performing wetting treatment on the substrate by using a corona method, a plasma treatment method or a chemical precoating method.

[0071] The ink can be selected from various types of metal-organic compound conductive inks with conductive properties, or conductive polymer inks, or metal nanoparticle conductive inks. The substrate can be selected from flexible polymer substrates such as PEN / PET / PDMS / PMMMA / PI, or rigid substrate materials such as glass or transparent acrylic plates. In this embodiment, nano-silver ink is selected as the ink, and polyethylene terephthalat...

Embodiment 2

[0140] Such as Figure 10 As shown, the present embodiment 2 provides a preparation system of a conductive microstructure, specifically comprising:

[0141] The raw material pretreatment and parameter setting module 4 is used to pretreat the ink and substrate, and set the inkjet printing parameters of the printing device;

[0142] The printing point spacing determination module 5 is used to perform a curing and sintering pre-experiment on the ink to obtain a relationship function between the self-assembly curvature radius of the ink and temperature, and import the relationship function into the printing device for analysis to obtain Function analysis results, and determine the printing dot pitch according to the function analysis results;

[0143] A single-layer printing module 6, configured to deposit the ink on the base printing layer according to the printing dot pitch for single-layer printing to obtain a single-layer printing pattern;

[0144] The multiple current excit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
transmittivityaaaaaaaaaa
transparencyaaaaaaaaaa
Login to View More

Abstract

The invention relates to a preparation method and system of a conductive microstructure. The method firstly preprocesses ink and substrate, and sets inkjet printing parameters of printing equipment; The relationship function between the self-assembled curvature radius of the ink and the temperature is used to determine the distance between the printing dots; and then the ink is deposited on the base printing layer for single-layer printing according to the distance between the printing dots to obtain a single-layer printing pattern; The single-layer printing pattern is sintered at a constant temperature, and according to the sintering state of the single-layer printing pattern, multiple current excitations are performed on the single-layer printing pattern by using a multiple current excitation device; finally, the process of single-layer printing is repeated to perform multi-layer printing to obtain Multi-curve, high-transparency conductive microstructures.

Description

technical field [0001] The invention relates to the field of inkjet printing of conductive microstructures, in particular to a method and system for preparing conductive microstructures. Background technique [0002] In recent years, inkjet printing technology has been increasingly used in various printed electronic products. It is a means of patterned deposition of functional materials, which can be used to prepare thin film transistors, photovoltaic cells, displays and smart phone touch screens. Electronic products can replace the photolithography and etching methods used in the manufacture of traditional silicon-based electronic devices. Compared with photolithography and etching methods that require the preparation of master plates, are expensive and have many steps, and are resource-wasting methods of "subtractive manufacturing", inkjet printing technology has the advantages of simple method, low cost, flexibility and environmental protection, and can efficiently Reali...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/01B41J3/407B41J11/00B41M5/00B41M7/00
CPCB41J2/01B41J3/407B41J11/002B41M5/0047B41M7/009
Inventor 张小栓杜佳诚汪学沛王想刘峰刘鹏飞徐进超张文峰
Owner CHINA AGRI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com