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Dry film resist composition

A technology of resist and composition, applied in the field of printed circuit board manufacturing, can solve the problems of poor filling, high cost, hard and brittle dry film resist, etc., and achieves excellent etching resistance, reduced production cost, good The effect of mechanical strength

Pending Publication Date: 2021-07-27
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of these two methods are that the obtained dry film resist becomes hard and brittle, and the resist pattern is prone to open circuits, gaps, and poor filling due to insufficient toughness.
Another way to improve the adhesion of dry film resist is to add adhesion promoters, commonly used adhesion promoters such as phosphoric acid group-containing (meth)acrylates, benzotriazole compounds, etc., However, the compatibility of these substances with the dry film resist system is not very good, the cost is extremely high, the amount of addition is very small, and the effect is extremely limited
In addition, due to the extremely small distance between the lines in the high-precision circuit and the extremely narrow space for rinsing during development, the requirements for the developability of the dry film resist are also extremely high. Performance, there will be obvious problems in its development

Method used

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  • Dry film resist composition
  • Dry film resist composition
  • Dry film resist composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] A dry film resist composition comprising 52 copies of the following weight: 52 alkaline soluble resins, 43 of the photopolymerizers, 0.7 of the photoinitiator, 4.3 additives; the base soluble resin is made of methacrylic acid, Methyl methacrylate, ethyl acrylate, and styrene are copolymerized by mass ratio 23: 25: 12: 40, the alkali soluble resolution is 149 mg KOH / g, the weight average molecular weight is 55000 g / mol, the molecular weight distribution coefficient is 1.8, the conversion rate was 98.0%; the photopolymerization monomer included a polar group modification, EO / PO modified (meth) acrylate compound (Polar Modified monomer 1), (4) ethoxy 5 parts of phenol A diacrylate, 19 parts of ethoxy bisphenol A diacrylate, (20) 8 parts of ethoxy bisphenol A diacrylate and (9) 5 parts of ethoxymethyl methacrylate; The photoinitiator comprises 0.5 parts of 9-phenyl acridine and 0.2 N-phenylidel; the additive includes a splendid green pigment 0.1 parts, a mortem crystal pu...

Embodiment 2

[0072] A dry film resist composition comprising a weight of the following weight: 52 parts of the alkaline soluble resin, 43 parts of the photopolymerizer, 0.7 of the photoinitiator, 4.3 parts of the additive; the photopolymerization monomer includes polarity Group modification, EO / PO modified (meth) acrylate compound (Polar Modified monomer 2), 5 parts of ethoxy bisphenol A diacrylate, (10) ethoxy bisphenol A 19 parts of acrylate and (20) 9 parts of ethoxy bisphenol A diacrylate; the additive includes 0.1 parts of a brilliant green pigment, 1.2 parts of tone crystalline purple, 1.2 parts of tribromylphenyl sulfone and methyl 1.9 parts of benzenesulfonamide; the base soluble resin material, the photoinitiator composition as in Example 1.

Embodiment 3

[0074] A dry film resist composition comprising a weight of the following weight: 52 parts of the alkaline soluble resin, 43.5 parts of the photopolymerization monomer, 0.6 photoinitiator, 3.9 parts of the additive; the photopolymerization monomer includes polarity Group modification, EO / PO modified (meth) acrylate compound (Polar Modified monomer 3), 5 parts of ethoxy bisphenol A diacrylate, (10) ethoxy bisphenol A 18 parts of acrylate, (20) ethoxy bisphenol A diacrylate 7 parts and and (9) 5.5 parts of ethoxymethyl methacrylate; the photoinitiator includes 9-phenyl acridine 0.5 parts and N- N- 0.1 parts of phenylidel; the additive comprises 0.1 parts of a brilliant green pigment, a rolling crystalline purple 1.1 parts, 1 part of tribromylphenyl sulfone and 1.7 parts of methylbenzenesulfonamide; the base soluble resin is used Example 1.

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Abstract

The invention belongs to the technical field of printed circuit board manufacturing, and particularly discloses a dry film resist composition which comprises the following raw materials in parts by weight of 45-65 parts of alkali-soluble resin, 35-50 parts of a photopolymerization monomer, 0.1-5.0 parts of a photoinitiator and 1.0-5.0 parts of an additive. The photopolymerization monomer comprises a polar group modified and EO / PO modified (methyl) acrylate compound, and the polar group is a phosphate group, an isocyanuric acid group, a 1, 3, 5-triazine group, a pyrimidine group or a quinazoline group. The polar group modified and EO / PO modified (methyl) acrylate compound introduced into the photopolymerization monomer has good compatibility with a dry film resist system, can effectively improve the adhesive force of the dry film resist, and does not cause adverse effects on the developability and flexibility of the dry film resist.

Description

Technical field [0001] The present invention belongs to the technical field of printing circuit board manufacturing, and more particularly to a dry film resist composition. Background technique [0002] In a printed circuit board, a lead frame, a solar cell, a conductor package, a Ball Grid Array, a dry film resist being widely used as a graphic transfer material. For example, when the printed circuit board is manufactured, the dry film resist is first to be bonded to the copper substrate, covering the dry film resist with a mask having a pattern, performing graphic exposure; then utilizing a weak alkaline aqueous solution as a developing fluid. Remove the unexposed part, then perform an etching or plating treatment to form a pattern; finally remove the dry film curing portion with the removal agent, thereby achieving graphical transfer. [0003] In the context of smart terminal equipment and 5G construction rapid advancement, the technology of the printed circuit board (PCB) ind...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027
CPCG03F7/027
Inventor 袁丽朱高华吴佳丰李伟杰钱伟强
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD