Production methods of intermediate-frequency oriented silicon steel ultra-thin strip and steel substrate of intermediate-frequency oriented silicon steel ultra-thin strip

Abstract

The invention particularly relates to production methods of an intermediate-frequency oriented silicon steel ultra-thin strip and a steel substrate of the intermediate-frequency oriented silicon steel ultra-thin strip, and belongs to the technical field of production of silicon steel ultra-thin strips. The production method of the steel substrate of the intermediate-frequency oriented silicon steel ultra-thin strip comprises the following steps: conducting cold rolling on a silicon steel raw material to obtain a silicon steel thin strip; and conducting annealing on the silicon steel thin strip to obtain the steel substrate, wherein a continuous annealing technology with at least three sections is adopted for annealing. The intermediate-frequency oriented silicon steel ultra-thin strip produced from the steel substrate produced by adopting the corresponding method has excellent magnetic performance and an excellent shape, multi-section annealing is adopted, stable finished product performance is obtained, the manufacturing technology is simple, the feasibility is high, the non-bottom-layer oriented silicon steel (silicon steel raw material) is adopted as base metal, energy is saved, environmental protection is achieved, the surface quality of a product is good, and the product can meet the use requirements under the condition of an intermediate frequency (higher than or equal to 400 Hz).

Description

technical field [0001] The invention belongs to the technical field of preparation of silicon steel ultra-thin strips, and in particular relates to a preparation method of oriented silicon steel ultra-thin strips for intermediate frequency and steel substrates thereof. Background technique [0002] Silicon steel is mainly used as the iron core material of various motors and transformers, and is an important core functional material in the electronics, electric power and other industries. As the thickness of silicon steel decreases, the eddy current loss continues to decrease, making it more suitable for applications under medium and high frequency conditions. Ultra-thin (thickness<0.1mm) oriented silicon steel has been widely used in electrical facilities, military manufacturing, precision electronics and other fields, and its preparation technology has been highly valued by scholars at home and abroad. [0003] At present, the reported production processes of ultra-thin...

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Problems solved by technology

[0004] During the invention process, the applicant found that there are certain problems in the current ultra-thin strip production process: the Goss grain size of the finished product by the primary recrystallization method is small, and the iron loss is high, so it is necessary to increase the grain size, but due to the existence of A small amount of {114}, {111} oriented grains are prone to abnormal growth, leading to performance deterioration, that is, the texture control is difficult and the stability is poor during annealing; at the same time, the primary recrystallization method is affected by the mother The microstructure and surface state of the base metal will seriously affect the quality of the final product. The slight difference in the microstructure and properties of the base metal, according to the conventional ultra-thin strip annealing process, will eventually cause large fluctuations in the magnetic properties of the ultra-thin strip.

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