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A kind of reactor assembly for preparing crystal by pvt method and its use method and application

A reactor and component technology, applied in the field of semiconductor material preparation, can solve problems such as inability to use large-scale, crystal growth rate limitation, increase crystal graphitization, etc., to improve sublimation rate and utilization rate, improve utilization rate, improve The effect of uniformity

Active Publication Date: 2022-04-12
SICC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Graphitization of silicon carbide raw materials is a common instability factor, which will increase the possibility of crystal graphitization and the formation of other defects, so that the crystal growth rate is largely limited
[0004] The current solution is to add additional solid silicon to the graphite crucible, which can compensate for the lack of silicon in the growth material and prevent the graphitization of the growth material to a certain extent, but this will lead to the formation of liquid silicon droplets and the formation of polymorphic structures. The second is to use tantalum crucibles to create an environment for adsorbing carbon, which can significantly inhibit the graphitization of growth raw materials, but the price of tantalum crucibles is too high to be used on a large scale

Method used

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  • A kind of reactor assembly for preparing crystal by pvt method and its use method and application
  • A kind of reactor assembly for preparing crystal by pvt method and its use method and application
  • A kind of reactor assembly for preparing crystal by pvt method and its use method and application

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Experimental program
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Effect test

Embodiment 1

[0085] refer to Figure 1-3 , the embodiment of the application discloses a reactor assembly for crystal growth, the reactor assembly includes a reaction chamber, a crystal growth chamber 3 and a flat plug flow mechanism; the reaction chamber includes a raw material chamber 1 and a waste chamber 2, and the crystal growth chamber 3 communicates with the raw material chamber 1 through the gas phase transmission channel, and the raw material gas generated by the sublimation of the raw material in the raw material chamber 1 is transported to the crystal growth chamber 3 through the gas phase transmission channel, and the flat push flow mechanism will generate the crystal growth process in the raw material chamber 1 The waste material is transferred to the waste chamber 2.

[0086] Specifically, the raw material cavity 1 and the waste material cavity 2 are separate chambers, and the separate raw material cavity 1 and the waste material cavity 2 can be adjacent to each other, and ca...

Embodiment 2

[0116] refer to Figure 4 The difference between this embodiment and Embodiment 1 is that the waste chamber 2 is sleeved on the periphery of the raw material chamber 1, and the waste chamber 2 is formed between the reaction chamber outer cylinder 11 and the reaction chamber inner cylinder 12, and the reaction chamber inner cylinder 12 forms the raw material chamber 1. In this setting mode, the top of the raw material chamber 1 is a high-temperature area, and the raw material is sublimated to grow crystals. The flat push flow mechanism removes the waste in the raw material chamber 1 in time, so that the waste falls into the bottom of the waste chamber 2. At this time, the waste is far away from the high-temperature area. It cannot continue to be sublimated by heat, avoiding crystal defects caused by waste materials, and further improving the growth quality of crystals.

[0117] As an embodiment, the material receiving platform 51 pushes the raw material in the raw material cha...

Embodiment 3

[0120] In an embodiment not shown, the raw material chamber 1 is formed between the reaction chamber outer cylinder 11 and the reaction chamber inner cylinder 12, and the waste material chamber 2 is arranged at the bottom, the top of the raw material chamber 1 or the outside of the reaction chamber outer cylinder 11, inside the reaction chamber The porosity of the surface of the cylinder 12 is higher than that of the surface of the reaction chamber outer cylinder 11. The seed crystal is arranged in the reaction chamber inner cylinder 12 in the form of a column. The extension direction of the seed crystal and the central axis of the reaction chamber inner cylinder 12 is roughly the same. A crystal growth chamber 3 is formed between the crystal and the inner side wall of the reaction chamber inner cylinder 12, and the heating device is arranged on the outside of the reaction chamber outer cylinder 11, so that the raw material gas in the raw material chamber 1 passes through the re...

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Abstract

The application discloses a reactor component for preparing crystals by PVT method, which belongs to the field of semiconductor material preparation. The reactor assembly includes: a reaction chamber, the reaction chamber includes a raw material chamber and a waste material chamber, the bottom end of the waste material chamber is lower than the bottom end of the raw material chamber; a heating mechanism, the heating mechanism is sleeved on the raw material The outer side of the chamber is used to heat the raw material chamber; the crystal growth chamber is connected to the raw material chamber through the gas phase transmission channel, and the raw material gas generated by the sublimation of the raw material in the raw material chamber is transported to the crystal growth at the seed crystal in the crystal growth chamber; and a plugging flow mechanism, the plugging flow mechanism moves the waste generated during the crystal growth process in the raw material chamber to the waste material chamber. The reactor assembly can move the waste material to the waste material cavity in time, improve the sublimation rate and utilization rate of the raw material, and reduce crystal defects.

Description

technical field [0001] The application relates to a reactor assembly for preparing crystals by PVT method, which belongs to the field of semiconductor material preparation. Background technique [0002] At present, in the preparation of silicon carbide crystals, physical vapor transport (PVT method for short) technology is mainly used, which decomposes silicon carbide raw materials into gas phase components Si by sublimation. m C n Finally, driven by the axial temperature gradient, it is transported to the seed crystal and grows into silicon carbide crystals. The PVT method is a complex process, and many parameters must be comprehensively controlled, such as growth temperature, temperature gradient, direct distance between the seed crystal and the growth material, gas pressure, etc. If any parameter is not well controlled, the stability of crystal growth Sex will be destroyed. [0003] In the later stage of the growth of silicon carbide crystals, the silicon carbide raw m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B23/00C30B29/36
CPCC30B23/002C30B29/36
Inventor 刘鹏飞刘星刘家朋李加林
Owner SICC CO LTD
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