Gallium-oxide-based high-power light-operated microwave device
A microwave device and gallium oxide technology, applied in the field of microelectronics, can solve the problems of small device size and power that cannot meet the needs of high-power devices, and achieve the effects of cost saving, high power, and overcoming the high background carrier concentration
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Embodiment 1
[0029] See figure 1 , figure 1 It is a schematic cross-sectional structure diagram of a gallium oxide-based high-power optically controlled microwave device provided by an embodiment of the present invention. As shown in the figure, the gallium oxide-based high-power optically controlled microwave device of this embodiment includes: a substrate layer 1 and an anode 2 and a cathode 3 correspondingly arranged on the upper and lower surfaces of the substrate layer 1, wherein the substrate layer 1 is doped + Gallium oxide material with divalent ions.
[0030] Specifically, the substrate layer 1 is Fe-doped gallium oxide material or Mg-doped gallium oxide material. In this embodiment, effective compensation is achieved by doping +2 valent ions (Fe or Mg) in gallium oxide, which overcomes the defect of high carrier concentration in the background of gallium oxide material. Due to Ga 2 o 3 Defects such as oxygen ion vacancies, Ga vacancies, or interstitial atoms are easily gener...
Embodiment 2
[0038] This embodiment specifically introduces the preparation method of the gallium oxide-based high-power optically controlled microwave device in the first embodiment.
[0039] Such as figure 1 The preparation process of the gallium oxide-based high-power optically controlled microwave device with both the anode 2 and the cathode 3 having a ring structure is as follows, wherein the ring structure electrodes of the anode 2 and the cathode 3 have an outer diameter of 8mm and an inner diameter of 5mm, The thickness of the electrode is 100nm, and the size of the substrate layer 1 is 14mm×14mm×0.5mm.
[0040] Step 1: polishing the substrate layer 1;
[0041] The doping concentration of Fe is 1.6×10 17 cm -3 The gallium oxide wafer was chemically and mechanically polished on both sides to obtain a gallium oxide crystal with a flat and smooth surface and a size of 14mm×14mm×0.5mm.
[0042] The polished gallium oxide wafer surface can form good contact with the electrodes (cath...
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