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A kind of parabolic polyimide film and preparation method thereof

A technology of polyimide film and polyimide, which is applied in the field of polymer materials, can solve problems such as high energy consumption and limited practical application, meet the requirements of simple experimental conditions, achieve uniformity and controllability, and implement process simple effect

Active Publication Date: 2022-05-20
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has high reliability and strong surface precision retention ability, but heating it above the glass transition temperature consumes a lot of energy, which limits the practical application of this method

Method used

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  • A kind of parabolic polyimide film and preparation method thereof
  • A kind of parabolic polyimide film and preparation method thereof
  • A kind of parabolic polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A. Using BTDA and ODA as monomers to synthesize a polyamic acid solution with a solid content of 12wt% in DMAc with a curvature of 5m -1 A parabolic polyamic acid nanofiber membrane with a thickness of 20 μm was spun by electrospinning on the parabolic substrate;

[0028] B. The nanofiber membrane obtained in step A is cyclized by heat treatment at 300° C. for 120 min to form a parabolic anchored polyimide network insoluble in DMAc;

[0029] C. Cast a layer of PAA with a thickness of 200 μm in a BPDA-ODA system with a solid content of 5 wt% on the parabolic anchored polyimide network obtained in step B, and then place it in a vacuum oven at 80 °C for 5 hours to evaporate the solvent , PAA is adsorbed on the polyimide network and is mutually dissolved and cured to obtain a film with a PAA / PI interpenetrating network structure;

[0030] D. The film obtained in step C is placed in an oven for heat treatment at 300° C. for 6 hours, to obtain a parabolic polyimide film.

Embodiment 2

[0032] A. Using BTDA and ODA as monomers to synthesize a polyamic acid solution with a solid content of 12wt% in DMAc at a curvature of 10m -1 A parabolic polyamic acid nanofiber membrane with a thickness of 20 μm was spun by electrospinning on the parabolic substrate;

[0033] B. The nanofiber membrane obtained in step A is cyclized by heat treatment at 300° C. for 120 min to form a parabolic anchored polyimide network insoluble in DMAc;

[0034] C. Cast a layer of PAA with a thickness of 200 μm in a BPDA-ODA system with a solid content of 5 wt% on the parabolic anchored polyimide network obtained in step B, and then place it in a vacuum oven at 80 °C for 5 hours to evaporate the solvent , PAA is adsorbed on the polyimide network and is mutually dissolved and cured to obtain a film with a PAA / PI interpenetrating network structure;

[0035] D. The film obtained in step C is placed in an oven for heat treatment at 300° C. for 6 hours, to obtain a parabolic polyimide film.

Embodiment 3

[0037] A. Using BTDA and ODA as monomers to synthesize a polyamic acid solution with a solid content of 12wt% in DMAc at a curvature of 10m -1 A parabolic polyamic acid nanofiber membrane with a thickness of 30 μm was spun by electrospinning on the parabolic substrate;

[0038] B. The nanofiber membrane obtained in step A is cyclized by heat treatment at 300° C. for 120 min to form a parabolic anchored polyimide network insoluble in DMAc;

[0039] C. Cast a layer of PAA with a thickness of 200 μm in a BPDA-ODA system with a solid content of 5 wt% on the parabolic anchored polyimide network obtained in step B, and then place it in a vacuum oven at 80 °C for 5 hours to evaporate the solvent , PAA is adsorbed on the polyimide network and is mutually dissolved and cured to obtain a film with a PAA / PI interpenetrating network structure;

[0040] D. The film obtained in step C is placed in an oven for heat treatment at 300° C. for 6 hours, to obtain a parabolic polyimide film.

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Abstract

A parabolic polyimide film material, wherein the base layer is polyimide nanofiber film and polyimide composite layer, the surface layer is polyimide layer, the thickness of the film is uniform and controllable, and the nanofiber film acts as a reinforcing fiber The role of the adsorbed PI forms an interpenetrating network structure, and the overall film is not easy to crack. The preparation method of the film of the present invention is simple in implementation process, easy to meet the conditions, applicable to all systems of polyimide, and the prepared parabolic polyimide film material has excellent mechanical properties, the overall film is not easy to crack, and at the same time through the nanofiber The membrane can realize the uniformity and controllability of the thickness of the parabolic polyimide film.

Description

technical field [0001] The invention belongs to the field of polymer materials, and relates to a parabolic polyimide film and a preparation method thereof. Background technique [0002] Polyimide has stable chemical properties and excellent mechanical properties, and has a series of advantages such as radiation resistance, flame retardancy, high temperature resistance, low temperature resistance, etc., so it is widely used in all walks of life. Among them, they are called "problem solvers". For polyimide materials, it is a relatively common and highly used material to make it into a polyimide film. In addition, polyimide film has the characteristics of high and low temperature resistance, high dimensional stability, high toughness, and can maintain chemical stability after repeated high temperature operations, so it is widely used in flexible printed circuit boards, spacecraft thermal control coatings. layer, radio frequency antenna, solar sail and other fields. According...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L79/08
CPCC08J5/18C08J2379/08C08J2479/08Y02E10/40
Inventor 齐胜利王希董南希田国峰武德珍
Owner BEIJING UNIV OF CHEM TECH
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