Adhesive with high electrical and thermal conductivity and preparation method thereof

A technology of conductive adhesive and conductive filler, used in conductive adhesives, adhesives, polymer adhesive additives, etc., can solve the problems of long production process, complex process, low efficiency, etc., to reduce system viscosity, improve electrical conductivity and thermal conductivity. performance, the effect of improving colloid compactness
CN113265210AInactive Publication Date: 2021-08-17北京中天鹏宇科技发展有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
北京中天鹏宇科技发展有限公司
Publication Date
2021-08-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an adhesive with high electrical and thermal conductivity and a preparation method thereof. The conductive adhesive comprises the following components in parts by weight: 5-10 parts of epoxy resin, 0.5-2 parts of a toughening agent, 3-5 parts of a curing agent, 0.03-0.06 part of a curing accelerator, 0.05-0.2 part of a coupling agent, 0.1-0.5 part of a thixotropic agent, 3-8 parts of a solvent and 82-96 parts of a conductive filler, the conductive filler is silver powder, the tap density is 3-6g / cc, and the average particle size is 2-5 microns. According to the technical scheme, the formula is based on epoxy resin, silver powder with different particle sizes is used as conductive filler to prepare the high-thermal-conductivity and high-electric-conductivity adhesive, and meanwhile, the high-thermal-conductivity and high-electric-conductivity adhesive has good electric conductivity and mechanical property; the heat conductivity is greater than 10W / m.k, and the heat conductivity coefficient is more than four times that of the conventional conductive adhesive; the volume resistivity is lower than 9 * 10 <-5 > omega.cm; and the shearing force is greater than 10Kgf.
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Description

technical field

[0001] The invention relates to the technical field of adhesives, in particular to an adhesive with high electrical and thermal conductivity and a preparation method thereof. Background technique

[0002] Conductive adhesive is an adhesive that has both conductive and adhesive functions, and is widely used in the bonding of chips, integrated circuits, high-power LEDs, and electronic components. Compared with traditional Sn / Pb solder, conductive adhesive has simple preparation process, low curing temperature, good mechanical properties, and environmental friendliness. It has become a trend to use conductive adhesive instead of traditional Sn / Pb solder, and it has also become a trend in the field of electronic packaging. The key material is more and more widely recognized.

[0003] At present, the thermal conductivity of the existing conductive adhesives on the market is generally below 5W / m·k, and the volume resistivity is 5×10 -4 Ω·cm or so, which still can...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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