Adhesive with high electrical and thermal conductivity and preparation method thereof

Abstract

The invention discloses an adhesive with high electrical and thermal conductivity and a preparation method thereof. The conductive adhesive comprises the following components in parts by weight: 5-10 parts of epoxy resin, 0.5-2 parts of a toughening agent, 3-5 parts of a curing agent, 0.03-0.06 part of a curing accelerator, 0.05-0.2 part of a coupling agent, 0.1-0.5 part of a thixotropic agent, 3-8 parts of a solvent and 82-96 parts of a conductive filler, the conductive filler is silver powder, the tap density is 3-6g / cc, and the average particle size is 2-5 microns. According to the technical scheme, the formula is based on epoxy resin, silver powder with different particle sizes is used as conductive filler to prepare the high-thermal-conductivity and high-electric-conductivity adhesive, and meanwhile, the high-thermal-conductivity and high-electric-conductivity adhesive has good electric conductivity and mechanical property; the heat conductivity is greater than 10W / m.k, and the heat conductivity coefficient is more than four times that of the conventional conductive adhesive; the volume resistivity is lower than 9 * 10 <-5 > omega.cm; and the shearing force is greater than 10Kgf.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an adhesive with high electrical and thermal conductivity and a preparation method thereof. Background technique [0002] Conductive adhesive is an adhesive that has both conductive and adhesive functions, and is widely used in the bonding of chips, integrated circuits, high-power LEDs, and electronic components. Compared with traditional Sn / Pb solder, conductive adhesive has simple preparation process, low curing temperature, good mechanical properties, and environmental friendliness. It has become a trend to use conductive adhesive instead of traditional Sn / Pb solder, and it has also become a trend in the field of electronic packaging. The key material is more and more widely recognized. [0003] At present, the thermal conductivity of the existing conductive adhesives on the market is generally below 5W / m·k, and the volume resistivity is 5×10 -4 Ω·cm or so, which still can...

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Problems solved by technology

[0003] At present, the thermal conductivity of the existing conductive adhesives on the market is generally below 5W / m·k, and the volume resistivity is 5×10 -4 Ω·cm, which still cannot meet the requirements of some high-power devices

[0004] Moreover, most of the high thermal and conductive adhesives on the market use nano-silver wires or chemically prepared reduced silver and micro-silver powder as conductive fillers. The process is relatively complicated and the cost is high, resulting in a long production process and low efficiency.

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