Circuit board substrate suitable for copper paste printing and manufacturing method thereof

A board substrate and circuit technology, applied in the field of circuit board substrate processing, can solve the problems of general circuit board substrate insulation performance, etc., to achieve the effect of improving mechanical properties, enhancing safety performance, and improving safety performance

Pending Publication Date: 2021-08-24
安徽鑫泰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Circuit board substrates generally have insulation properties, but the insulation performance of ordinary circuit board substrates is average. In printed circuit boards, in order to improve the safety and service life of their applications, it usually needs to be modified

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A circuit board substrate suitable for copper paste printing, said circuit board substrate suitable for copper paste printing is made of the following raw materials in parts by weight: 45 parts of epoxy resin, 12 parts of silicone resin, 14 parts of phenolic resin, 3 parts of polyhexamethylene adipamide, 1 part of polyethyleneimine, 10 parts of polyethylene glycol, 13 parts of modified silicon carbide, 4 parts of nano silicon dioxide, 2 parts of boron nitride, 1 part of graphene, alkane 2 parts of alcohol amide, 1 part of methylpyrrolidone, 1 part of N,N-dimethylformamide, 2 parts of white carbon black, 1 part of diethylenetriamine, 1 part of antioxidant, 1 part of copper foil, among which modified carbonization The silicon preparation process includes the following steps:

[0029] (1) Place silicon carbide in a calciner for calcination at 800°C for 1 hour, then take it out and pulverize it to obtain calcined powder for later use;

[0030] (2) Add the above-mentioned c...

Embodiment 2

[0040] A circuit board substrate suitable for copper paste printing, said circuit board substrate suitable for copper paste printing is made of the following raw materials in parts by weight: 60 parts of epoxy resin, 18 parts of silicone resin, 20 parts of phenolic resin, 5 parts of polyhexamethylene adipamide, 3 parts of polyethyleneimine, 20 parts of polyethylene glycol, 16 parts of modified silicon carbide, 6 parts of nano silicon dioxide, 4 parts of boron nitride, 3 parts of graphene, alkane 3 parts of alcohol amide, 2 parts of methylpyrrolidone, 2 parts of N,N-dimethylformamide, 4 parts of white carbon black, 3 parts of diethylenetriamine, 2 parts of antioxidant, 3 parts of copper foil, among which modified carbonization The silicon preparation process includes the following steps:

[0041] (1) Place the silicon carbide in a calciner and calcinate it at 1200°C for 2 hours, then take it out and pulverize it to obtain calcined powder for later use;

[0042] (2) Add the abo...

Embodiment 3

[0052] A circuit board substrate suitable for copper paste printing, said circuit board substrate suitable for copper paste printing is made of the following raw materials in parts by weight: 55 parts of epoxy resin, 15 parts of silicone resin, 18 parts of phenolic resin, 4 parts of polyhexamethylene adipamide, 2 parts of polyethyleneimine, 15 parts of polyethylene glycol, 15 parts of modified silicon carbide, 5 parts of nano silicon dioxide, 3 parts of boron nitride, 2 parts of graphene, alkane 2.5 parts of alcohol amide, 1.5 parts of methylpyrrolidone, 1.5 parts of N,N-dimethylformamide, 3 parts of white carbon black, 2 parts of diethylenetriamine, 1.5 parts of antioxidant, 2 parts of copper foil, among which modified carbonization The silicon preparation process includes the following steps:

[0053] (1) Place silicon carbide in a calciner and calcinate at 1000°C for 1.5 hours, then take it out and pulverize it to obtain calcined powder for later use;

[0054] (2) Add the ...

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PUM

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Abstract

The invention provides a circuit board substrate suitable for copper paste printing and a manufacturing method thereof, and relates to the technical field of circuit board substrate processing. The circuit board substrate comprises epoxy resin, silicon resin, phenolic resin, polyhexamethylene adipamide, polyethyleneimine, polyethylene glycol, modified silicon carbide, nano silicon dioxide, boron nitride, graphene, alkanolamide, methyl pyrrolidone and N, N-dimethylformamide, white carbon black, diethylenetriamine, an antioxidant and copper foil through the steps of resin modification, base material mixing, auxiliary material mixing, raw material mixing, pressing and shaping and the like, the defects in the prior art are overcome, the insulating property of the circuit board substrate is enhanced while the mechanical property of the circuit board substrate is effectively improved, the safety is further improved; and the service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of circuit board substrate processing, in particular to a circuit board substrate suitable for copper paste printing and a manufacturing method thereof. Background technique [0002] Substrate is the basic material for manufacturing circuit boards. In general, substrates are copper-clad laminates. Single- and double-sided printed boards are manufactured on the substrate material-copper-clad laminates, selectively processing holes, Electroless copper plating, electroplating copper, etching and other processing to obtain the required circuit pattern, which has three functions of conduction, insulation and support, the performance, quality, processability in manufacturing, manufacturing cost, and manufacturing level of printed boards, etc. , depends largely on the substrate material. [0003] Circuit board substrates generally have insulation properties, but the insulation performance of ordinary circuit board...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/00
CPCH05K1/0353H05K3/0011
Inventor 陈树豪
Owner 安徽鑫泰电子科技有限公司
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