Circuit board substrate suitable for copper paste printing and manufacturing method thereof
A board substrate and circuit technology, applied in the field of circuit board substrate processing, can solve the problems of general circuit board substrate insulation performance, etc., to achieve the effect of improving mechanical properties, enhancing safety performance, and improving safety performance
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Embodiment 1
[0028] A circuit board substrate suitable for copper paste printing, said circuit board substrate suitable for copper paste printing is made of the following raw materials in parts by weight: 45 parts of epoxy resin, 12 parts of silicone resin, 14 parts of phenolic resin, 3 parts of polyhexamethylene adipamide, 1 part of polyethyleneimine, 10 parts of polyethylene glycol, 13 parts of modified silicon carbide, 4 parts of nano silicon dioxide, 2 parts of boron nitride, 1 part of graphene, alkane 2 parts of alcohol amide, 1 part of methylpyrrolidone, 1 part of N,N-dimethylformamide, 2 parts of white carbon black, 1 part of diethylenetriamine, 1 part of antioxidant, 1 part of copper foil, among which modified carbonization The silicon preparation process includes the following steps:
[0029] (1) Place silicon carbide in a calciner for calcination at 800°C for 1 hour, then take it out and pulverize it to obtain calcined powder for later use;
[0030] (2) Add the above-mentioned c...
Embodiment 2
[0040] A circuit board substrate suitable for copper paste printing, said circuit board substrate suitable for copper paste printing is made of the following raw materials in parts by weight: 60 parts of epoxy resin, 18 parts of silicone resin, 20 parts of phenolic resin, 5 parts of polyhexamethylene adipamide, 3 parts of polyethyleneimine, 20 parts of polyethylene glycol, 16 parts of modified silicon carbide, 6 parts of nano silicon dioxide, 4 parts of boron nitride, 3 parts of graphene, alkane 3 parts of alcohol amide, 2 parts of methylpyrrolidone, 2 parts of N,N-dimethylformamide, 4 parts of white carbon black, 3 parts of diethylenetriamine, 2 parts of antioxidant, 3 parts of copper foil, among which modified carbonization The silicon preparation process includes the following steps:
[0041] (1) Place the silicon carbide in a calciner and calcinate it at 1200°C for 2 hours, then take it out and pulverize it to obtain calcined powder for later use;
[0042] (2) Add the abo...
Embodiment 3
[0052] A circuit board substrate suitable for copper paste printing, said circuit board substrate suitable for copper paste printing is made of the following raw materials in parts by weight: 55 parts of epoxy resin, 15 parts of silicone resin, 18 parts of phenolic resin, 4 parts of polyhexamethylene adipamide, 2 parts of polyethyleneimine, 15 parts of polyethylene glycol, 15 parts of modified silicon carbide, 5 parts of nano silicon dioxide, 3 parts of boron nitride, 2 parts of graphene, alkane 2.5 parts of alcohol amide, 1.5 parts of methylpyrrolidone, 1.5 parts of N,N-dimethylformamide, 3 parts of white carbon black, 2 parts of diethylenetriamine, 1.5 parts of antioxidant, 2 parts of copper foil, among which modified carbonization The silicon preparation process includes the following steps:
[0053] (1) Place silicon carbide in a calciner and calcinate at 1000°C for 1.5 hours, then take it out and pulverize it to obtain calcined powder for later use;
[0054] (2) Add the ...
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