Light porcelain insulation board and preparation method thereof

Abstract

The invention discloses a light porcelain insulation board and a preparation method thereof, and belongs to the technical field of light porcelain insulation boards. In the prior art, in order to ensure that all raw materials have a large contact area and are fully combined in the sintering process, the particle size of a matrix raw material which is generally adopted is usually small and is generally smaller than 1.5 mm, although the sintering difficulty is reduced, the superfine matrix particles are layered more easily in the sintering process, and the modification performance and even the yield of an intermediate are low. According to the light porcelain insulation board, the perlite particles with the particle size of 1-10 mm are matched with the inorganic foaming adhesive which mainly comprises 10-84 parts of ceramic dry particles, 10-70 parts of ceramic frits, 5-30 parts of bentonite, 0.1-3 parts of foaming agent and 0.1-3 parts of ligand enhancer, the light porcelain insulation board is prepared, and the light porcelain insulation board is low in heat conductivity coefficient, simple in component, easy to prepare and high in yield.

Description

technical field [0001] A light porcelain thermal insulation board and a preparation method thereof belong to the technical field of light porcelain thermal insulation boards. Background technique [0002] Thermal conductivity is the most important performance index of light porcelain insulation board, which represents the heat insulation effect of the product and also represents the energy saving effect of the product. [0003] Existing methods for reducing thermal conductivity of thermal insulation products and improving thermal insulation effect include adding various thermal insulation materials; increasing the volume ratio of closed holes in the material body; adhering other thermal insulation materials, etc. The preparation process is cumbersome, the production cycle is long, and the production cost is high. [0004] In addition, in the prior art, in order to ensure a large contact area between various raw materials during the sintering process, the particle size of th...

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Problems solved by technology

[0003] Existing methods to reduce the thermal conductivity of thermal insulation products and improve the thermal insulation effect include adding various thermal insulation materials; increasing the volume ratio of closed pores in the material body; However, most of these methods have problems such as more raw materials selection, cumbersome preparation process, long production cycle and high production cost.

[0004]In addition, in the prior art, in order to ensure a large contact area between various raw materials in the sintering process and fully combine, the commonly used matrix raw material particle size is often Smaller, generally less than 1.5mm, although the difficulty of sintering is reduced, the matrix particles that are too fine are more likely to be layered during the sintering process, and cannot be mixed evenly with the added ingredients, resulting in the modified performance of the intermediate and even lower yield