Provided is a method of manufacturing a
semiconductor device which improves the grain size of the polysilicon channel and suppresses adverse effects resulting from remaining
metal contents. After deposition of the polysilicon channel layer, a capping layer is deposited on the polysilicon channel layer. The capping layer comprises a
metal aluminum
alloy layer. The device is then annealed to increase the grain size of the polysilicon channel layer, and then the capping layer is removed.