Thin film preparation method, high-throughput combined material chip preparation method and system thereof

Abstract

The invention relates to the field of thin film material preparation, and provides a thin film preparation method which can be used for rotating a target material and controlling the rotating speed of the target material, so that when a to-be-deposited material of a previous target material does not form a layered thin film in an island-shaped growth state, another target material continues to be deposited, the to-be-deposited materials of different target materials can be deposited in an atom mixing manner, so that uniform mixing of various materials can be realized without additionally arranging a heat treatment process, the thin film preparation difficulty is greatly reduced, and the precision and yield of thin film preparation are improved. The invention further provides a preparation method and system for a high-throughput combined material chip, high-throughput combined deposition of the to-be-deposited materials of different target materials in an atom mixing mode can be achieved, the preparation process of the high-throughput combined material chip is simplified, the high-throughput combined material chip is obtained by combining the related high-throughput characterization technology, mass material data is rapidly provided for construction of a material gene database, and finally on-demand design and intelligent manufacturing of materials are promoted.

Description

【Technical field】 [0001] The invention relates to the field of thin film material preparation, in particular to a thin film preparation method, a high-throughput combined material chip preparation method and a device thereof. 【Background technique】 [0002] With the continuous deepening of material technology research, high-throughput material test technology has been developed rapidly, which is essentially the controllable distribution of multiple components or preparation processes on a substrate through microelectronics technology or other precision preparation methods and precise micro-area preparation, realize the preparation of up to 1 million sample units with different components or other process parameters on a substrate, and cooperate with high-throughput fast scanning or parallel characterization technology, it is possible to realize a complex system in a relatively short period of time. The systematic preparation and testing of experimental samples, the final qua...

AI Technical Summary

Problems solved by technology

[0004]In order to overcome the existing high-throughput thin film sample technology based on the multilayer film diffusion process, material sample preparation needs to match special heat treatment temperature, atmosphere and preparation process, which is time-consuming To solve technical problems such as laboriousness, the present invention provides a thin film preparation method, a high-throughput composite material chip preparation method and a device thereof

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