Pulse copper electroplating additive, electroplating solution and application of electroplating solution

A technology of pulse electroplating and additives, applied in jewelry and other fields, can solve problems such as crystallization of electroplated copper and reduction of mechanical properties of electroplated copper layer

Active Publication Date: 2021-09-10
SHENZHEN BEIJIA ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is that in the traditional pulse electroplating copper method, the reverse pulse current easily leads to electroplated copper crystallization, thereby reducing the me...

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  • Pulse copper electroplating additive, electroplating solution and application of electroplating solution
  • Pulse copper electroplating additive, electroplating solution and application of electroplating solution

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Embodiment 1

[0020] This embodiment provides a kind of pulse electroplating copper additive, and this additive is the solution that is made by sulfonate, organic amine modified glycidyl ether, polyether compound and deionized water, and in solution, described sulfonate is 3- (Benzothiazole-2-mercapto)-sodium propanesulfonate and sodium mercaptoimidazole benzenesulfonate, the mass concentration of the 3-(benzothiazole-2-mercapto)-propanesulfonate sodium is 2g / L, the described The mass concentration of sodium mercaptoimidazole benzenesulfonate is 3g / L. The organic amine-modified glycidyl ether is prepared by polycondensation of an organic amine with polyethylene glycol diglycidyl ether or castor oil diglycidyl ether at a molar ratio of 2:1. Specifically, this example The described organic amine-modified glycidyl ether comprises a polycondensate made of ethylamine and polyethylene glycol diglycidyl ether with a concentration of 30g / L and a polycondensate made of ethylenediamine and polyethyle...

Embodiment 2

[0024] This embodiment provides a kind of pulse electroplating copper additive, and this additive is the solution that is made by sulfonate, organic amine modified glycidyl ether, polyether compound and deionized water, and in solution, described sulfonate is 3- (Benzothiazole-2-mercapto)-propanesulfonate sodium, 2-mercaptobenzimidazole-5-sodium sulfonate and 3-(5-mercapto-1-tetrazolyl)sodium benzenesulfonate, the 3- The mass concentration of (benzothiazole-2-mercapto)-propanesulfonate sodium is 1g / L, and the mass concentration of the 2-mercaptobenzimidazole-5-sodium sulfonate is 1g / L, and the 3-(5 -The mass concentration of sodium mercapto-1-tetrazolyl)benzenesulfonate is 2g / L. The organic amine-modified glycidyl ether is prepared by polycondensation of an organic amine with polyethylene glycol diglycidyl ether or castor oil diglycidyl ether at a molar ratio of 2:1. Specifically, this example The organic amine-modified glycidyl ether includes a polycondensate made of ethylen...

Embodiment 3

[0028] This embodiment provides a kind of pulse electroplating copper additive, and this additive is the solution that is made by sulfonate, organic amine modified glycidyl ether, polyether compound and deionized water, and in solution, described sulfonate is 3- (Benzothiazole-2-mercapto)-propanesulfonate sodium, the mass concentration of the 3-(benzothiazole-2-mercapto)-propanesulfonate sodium is 5g / L. The organic amine-modified glycidyl ether is prepared by polycondensation of an organic amine with polyethylene glycol diglycidyl ether or castor oil diglycidyl ether at a molar ratio of 2:1. Specifically, this example The organic amine-modified glycidyl ether is a condensation polymer prepared from propylenediamine and polyethylene glycol diglycidyl ether with a concentration of 10 g / L. The polyether compound is 1,2-propylene glycol polyoxypropylene polyoxyethylene ether, and the mass concentration of the 1,2-propylene glycol polyoxypropylene polyoxyethylene ether is 10 g / L. ...

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Abstract

The invention discloses a pulse copper electroplating additive, an electroplating solution and application of the electroplating solution. The additive comprises sulfonate, organic amine modified glycidyl ether, a polyether compound and water, wherein the mass concentration of the sulfonate is 2-20 g/L, the mass concentration of the organic amine modified glycidyl ether is 10-100 g/L, and the mass concentration of the polyether compound is 10-100 g/L. When the additive is added into the electroplating solution for pulse electroplating of a circuit board, especially in the pulse electroplating process of a high-aspect-ratio circuit board, no columnar directional crystal is generated in a hole of the circuit board, no columnar crystal is generated at an orifice corner, the mechanical property of an electroplated copper layer in the hole is improved, the risk of fracture of the copper layer is reduced, and therefore, the stability of a terminal electronic product is improved.

Description

technical field [0001] The invention belongs to the technical field of pulse electroplating, and relates to a pulse electroplating copper additive and its preparation method and application, in particular to a pulse electroplating copper additive electroplating solution and electroplating solution suitable for processing high-reliability printed circuit boards. Background technique [0002] In recent years, with the continuous development of communication technology, medical electronics, aerospace and other fields, the requirements for Printed Circuit Board (PCB) are getting higher and higher, which makes PCB tend to be more small-aperture, high-density, With the development of multi-layers, the increase in the number of layers and thickness of the printed circuit board and the decrease in the aperture make the ratio of the thickness of the product board to the aperture of the conductive hole (that is, the aspect ratio) increase significantly. This circuit board is called a h...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18C25D7/00C25D5/54
CPCC25D3/38C25D5/18C25D7/00C25D5/54Y02P10/20
Inventor 黎坊贤钟俊昌黎刚吴奇聪
Owner SHENZHEN BEIJIA ELECTRONICS MATERIAL
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