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Device and method for high-precision surface polishing through laser

A surface polishing, high-precision technology, applied in the field of laser polishing, can solve the problems of complex knife removal operation, poor automation level, hidden danger environment, etc., to achieve the effect of fast and accurate removal, precise polishing, and avoiding secondary clamping

Active Publication Date: 2021-09-17
HUAZHONG UNIV OF SCI & TECH
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Problems solved by technology

[0004]Aiming at the defects of the prior art, the object of the present invention is to provide a device and method for high-precision surface polishing using laser, aiming to solve the existing problem of removing knife lines The method is complex in operation, poor in automation level, has potential safety hazards and pollutes the environment

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  • Device and method for high-precision surface polishing through laser

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Embodiment Construction

[0054] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0055]The invention discloses a device and method for high-precision surface polishing using laser, which includes the following steps: installing laser knife mark removal equipment on an ultra-precision machine tool, controlling the position of the laser spot by adjusting the vibrating mirror, so that it is aligned with the single crystal to be processed The center of the silicon wafer is of the same height to achieve the optimal use state. Then adjust the processing parameters of the laser, and make the machine tool walk according to the preset trajectory, so that the laser center scanning trajec...

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Abstract

The invention provides a device and a method for high-precision surface polishing through laser. The device comprises a laser device, a beam expander, a galvanometer and a field lens; the laser device emits laser; the beam expander is arranged at a light outlet of the laser device and is used for changing a divergence angle of laser emitted by the laser device to obtain a collimated laser beam; the galvanometer is arranged at a light outlet of the beam expander and is used for adjusting the irradiation position of the collimated laser beam, so that the irradiation position is aligned to the wave crest of knife ripples of a workpiece; the field lens is arranged at a light outlet of the galvanometer and used for achieving light beam focusing and obtaining high-power-density light spots symmetrical to the knife ripples in size; and the high-power-density light spots are aligned to the wave crest position of knife ripples of the workpiece, and the knife ripple wave crest is melted, so that high-precision polishing is conducted on the surface of the workpiece. After the workpiece is turned by a machine tool, the workpiece is directly polished by laser processing equipment so as to remove the knife ripples, so that the automation and integration of processing are realized. Through the method, the knife ripples can be removed with great efficiency, and the material surface roughness is reduced.

Description

technical field [0001] The invention belongs to the technical field of laser polishing, and more specifically relates to a device and method for high-precision surface polishing using laser. Background technique [0002] Monocrystalline silicon is an important optical material. Ultra-smooth silicon-based mirrors are widely used in advanced optical systems such as space imaging detection, weapon optical guidance, and major scientific and technological infrastructure. The surface roughness and subsurface damage of the mirror determine the imaging quality and service life of the optical system. If the manufacturing technology of such an ultra-smooth surface cannot be broken through, it will seriously restrict the development of my country in the above-mentioned advanced optical field. Although the single-point diamond cutting technology can obtain better surface roughness and ideal surface accuracy, the principle of cutting will inevitably lead to knife lines on the surface of ...

Claims

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Application Information

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IPC IPC(8): B23K26/352B23K26/064
CPCB23K26/3576B23K26/064
Inventor 许剑锋黄惟琦肖峻峰吴艳玲李涛陈肖张建国
Owner HUAZHONG UNIV OF SCI & TECH
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