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Processing technology of high-thermal-conductivity aluminum substrate

A processing technology and technology of aluminum substrates, applied in circuit substrate materials, circuit thermal devices, electrical components, etc., can solve the problems of inability to meet the heat dissipation requirements of electronic products, thin anode thickness of aluminum substrates, and poor thermal conductivity, etc., to increase the thickness. , The breakdown voltage is stable, the effect of reducing the thickness

Pending Publication Date: 2021-09-21
浙江德加电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In short, the existing aluminum-based copper-clad laminates mainly have the following four deficiencies: First, the existing film technology has a small thermal conductivity, which currently does not exceed 12W / m K; second, if the thickness of the thermal film is reduced, the pressure resistance The value will decrease; the third is that when the thickness of the thermal film is increased, the heat conduction effect will become worse; the fourth is that the thickness of the anode of the existing aluminum substrate is thin, and the withstand voltage value is low
[0004] With the development of the electronics industry, electronic products need to transmit heat quickly, and the aluminum substrates with conventional structures in the market can no longer meet the heat dissipation requirements of electronic products, so it is necessary to seek substrates with better thermal conductivity to process and manufacture PCBs

Method used

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  • Processing technology of high-thermal-conductivity aluminum substrate

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Embodiment 1

[0028] A processing technology for a high thermal conductivity aluminum substrate, specifically comprising the following steps:

[0029] S1. Choose 1060 series aluminum plate, the thickness of the aluminum plate is 0.5-3.0 mm;

[0030] S2. Anodize the 1060 aluminum plate, the thickness of the anode is 30-120 microns; the oxidation time is 2-20 hours, the voltage is controlled at 14V-22V, and the current is controlled at 3500-4200A;

[0031] S3. Take the pressed steel plate mold and place the steel plate lower mold;

[0032] S4. Tiling the bottom copper foil;

[0033] S5. Place the heat-conducting adhesive film for insulation and heat dissipation flatly, and the thickness of the adhesive film is 25-200 mm;

[0034] S6. Place the thick anode of the aluminum plate downwards, and the anode film is in contact with the heat-conducting adhesive film;

[0035] S7. Place the upper mold of the steel plate, fasten the upper and lower steel plates and push them into the press, and pres...

Embodiment 2

[0051] A process for processing high thermal conductivity aluminum substrates. Compared with Example 1, the anode thickness of the aluminum plate is 20-150 microns; the oxidation time is 5-20 hours, the voltage is controlled at 14V-22V, and the current is controlled at 3500-4200A; other processes Process is the same as embodiment 1.

Embodiment 3

[0053] A processing technology for a high heat-conducting aluminum substrate, compared with Embodiment 1, the thickness of the heat-conducting adhesive film is 50-100 mm; other processes are the same as Embodiment 1.

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Abstract

The invention discloses a processing technology of a high-thermal-conductivity aluminum substrate. An aluminum substrate is subjected to double-sided anodic oxidation or single-sided anodic oxidation, and the anode thickness of a formed aluminum oxide layer is 30-150 microns. The thickness of the anode is increased to 30-150 microns by increasing the thickness of the anode, so that an Al2O3 ceramic layer is generated on the surface of the aluminum plate, and the Al2O3 ceramic layer can take the dual effects of heat dissipation and insulation. The aluminum oxide with the thick anode, the heat-conducting adhesive film and the copper foil are laminated by utilizing a heat-conducting adhesive film bonding technology, so that a novel aluminum substrate with high heat dissipation performance, low thermal resistance and high pressure resistance can be produced.

Description

technical field [0001] The invention relates to a processing technology of an aluminum substrate, in particular to a processing technology of a high thermal conductivity aluminum substrate. Background technique [0002] Copper-clad laminate is one of the basic materials of PCB. It is a plate-like material formed by impregnating the reinforcing material with resin, one or both sides covered with copper foil, and hot-pressed. The role of insulation and support. [0003] At present, the commonly used aluminum-based copper clad laminates on the market can be divided into the following types according to the material of the insulating layer: glass fiber cloth type, glued copper foil type, ceramic powder filled thermal conductive adhesive film type, polyimide film type, etc. main category. The polyimide film is used to bend the metal substrate, which is not discussed yet. Due to the influence of the resin composition of the remaining similar insulating media, the thermal conduc...

Claims

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Application Information

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IPC IPC(8): H05K3/02H05K1/02H05K1/03
CPCH05K3/022H05K1/0306H05K1/0201
Inventor 张于均张晓辉
Owner 浙江德加电子科技有限公司
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