Cleaning method of solar cell
A technology for solar cells and cleaning fluids, applied in the direction of cleaning methods using liquids, cleaning methods and utensils, chemical instruments and methods, etc., can solve the problems of low solar cell preparation efficiency, save preparation time, reduce quantity, and reduce preparation Process effect
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Embodiment 1
[0044] Please refer to figure 2 , in the present embodiment, the cleaning method of solar cell, comprises the following steps:
[0045] Step A1: providing a semiconductor substrate layer.
[0046] In this embodiment, the semiconductor substrate layer includes an N-type silicon substrate, specifically, the semiconductor substrate layer is an N-type single crystal silicon substrate.
[0047] Step A2: Perform pretreatment on the semiconductor substrate layer, the pretreatment includes precleaning, removing the damaged layer and first oxidative cleaning.
[0048] Step A21: pre-cleaning the semiconductor substrate layer to remove impurities on the surface of the semiconductor substrate layer.
[0049] Through pre-cleaning, organic matter and metal impurity pollutants on the surface of the semiconductor substrate layer are removed.
[0050] Step A22: removing the damaged layer on the surface of the semiconductor substrate layer.
[0051] Since a damaged layer is formed on the s...
Embodiment 2
[0077] In this embodiment, before performing the slow pulling cleaning process, the surface of the semiconductor substrate layer is cleaned with an acidic cleaning solution.
[0078] Specifically, please refer to image 3 , in other embodiments, the cleaning method of solar cell, comprises the steps:
[0079] Step B1: providing a semiconductor substrate layer.
[0080] In this embodiment, the semiconductor substrate layer includes an N-type silicon substrate, specifically, the semiconductor substrate layer is an N-type single crystal silicon substrate.
[0081] Before the surface of the semiconductor substrate layer is subjected to the texturing treatment, the semiconductor substrate layer is pre-cleaned, the damaged layer is removed and the first oxidative cleaning process is carried out referring to the aforementioned content.
[0082] Step B2: performing texturing treatment on the surface of the semiconductor substrate layer.
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