Probe card and wafer test system

A probe card and probe technology, applied in the field of probe cards, can solve the problems of inability to increase the test area and ensure the flatness of the tip of the probe, so as to improve the test efficiency and accuracy, and reduce the flatness requirements. The effect of area expansion

Pending Publication Date: 2021-10-08
上海泽丰半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a probe card and a wafer testing system to solve the problem in the prior art that the test area cannot be increased while ensuring the flatness of the probe tip

Method used

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  • Probe card and wafer test system
  • Probe card and wafer test system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] An embodiment of the present invention, such as figure 1 As shown, the present invention provides a probe card, including a PCB board 1 , a ceramic substrate 2 and a probe head 3 .

[0042] The ceramic substrate 2 is arranged on the PCB board 1 ; the probe head 3 is arranged on the ceramic substrate 2 , and the probe head 3 includes a guide plate 4 on which several uniformly distributed probes 5 are arranged.

[0043] Wherein, a plug board 6 is arranged between the PCB board 1 and the ceramic substrate 2, and a plurality of pogo pins passing through the plug board 6 are arranged on the plug board 6, and both ends of the pogo pins are fixedly connected with the PCB board 1 and the ceramic substrate 2 respectively.

[0044]Usually, the wafer test requires that the flatness of the tip of all probes (the flatness is the height difference of the tip) is less than 50um. Challenges; and with the test requirements of high test efficiency and high data throughput rate, the cust...

Embodiment 2

[0051] An embodiment of the present invention, such as figure 2 As shown, the present invention provides a probe card, including a PCB board 1 , a ceramic substrate 2 and a probe head 3 .

[0052] The ceramic substrate 2 is arranged on the PCB board 1 ; the probe head 3 is arranged on the ceramic substrate 2 , and the probe head 3 includes a guide plate 4 on which several uniformly distributed probes 5 are arranged.

[0053] Wherein, a plug board 6 is arranged between the PCB board 1 and the ceramic substrate 2, and a plurality of pogo pins passing through the plug board 6 are arranged on the plug board 6, and both ends of the pogo pins are fixedly connected with the PCB board 1 and the ceramic substrate 2 respectively.

[0054] An organic substrate 7 is disposed between the ceramic substrate 2 and the probe head 3 , and the organic substrate 7 is fixedly connected to the ceramic substrate 2 by way of circuit welding.

[0055] Usually, the wafer test requires that the flatne...

Embodiment 3

[0064] In an embodiment of the present invention, on the basis of Embodiment 1 or 2, the pogo pin includes a fixed section and a telescopic section, the fixed section is provided with an insertion hole, and the bottom end of the telescopic section is movably inserted into the insertion hole.

[0065] Specifically, when the fixed section and the telescopic section are connected, an external spring or an internal spring can be selected. When the spring is built in, a first spring can be arranged in the jack, and the two ends of the first spring are fixedly connected with the bottom end of the telescopic section and the bottom end of the jack respectively; An annular block is provided at the top of the telescopic section, and a second spring is sheathed outside the telescopic section, and the two ends of the second spring are respectively fixedly connected with the annular block and the top of the fixed section.

[0066] In addition, when connecting the PCB board and the ceramic ...

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Abstract

The invention provides a probe card and a wafer test system. The probe card comprises a PCB; a ceramic substrate arranged on the PCB; a probe head arranged on the ceramic substrate, wherein the probe head comprises a guide plate, and a plurality of uniformly distributed probes are arranged on the guide plate; wherein an insertion plate is arranged between the PCB and the ceramic substrate, a plurality of spring needles penetrating through the insertion plate are arranged on the insertion plate, and the two ends of each spring needle are fixedly connected with the PCB and the ceramic substrate respectively. According to the probe card, the flatness of the tip of the probe can be ensured while the test area is increased, so that the test of a wafer is facilitated.

Description

technical field [0001] The invention relates to the technical field of probe cards, in particular to a probe card and a wafer testing system. Background technique [0002] In the semiconductor wafer testing stage, unpackaged chips (bare chips) on the wafer need to be tested, and probe cards are used in the testing process. The probe card is mainly divided into 3 parts, the printed circuit board (PCB), the substrate (MLO / MLC) and the probe head (Probe head). One end is tied to the pad of the wafer. In this way, an electrical connection is established between the wafer and the PCB (testing machine), resources are allocated through the testing machine and automated testing is completed, thereby ensuring the quality of the bare chip on the wafer. [0003] Usually, the wafer test requires that the flatness of the tip of all probes (the flatness is the height difference of the tip) is less than 50um. challenge, which requires that the main components of the probe card, the prin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R1/073G01R31/28
CPCG01R1/06738G01R1/06722G01R1/073G01R31/2886G01R31/2884G01R31/2834
Inventor 梁建罗雄科
Owner 上海泽丰半导体科技有限公司
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