Method for improving binding force of coating on plastic surface
A bonding force and coating technology, applied in the field of plastic surface metallization, can solve the problems of complex surface roughening process of injection molded parts, and achieve the effects of light weight, cost saving and good dimensional stability
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Embodiment 1
[0036] A method for improving the binding force of the plastic coating, the base material is a carbon fiber reinforced polyetherimide composite material, wherein the carbon fiber content is 30%, the bottom layer material of the seed layer is Ti (about 50nm), and the material of the outer layer is Cu ( about 250 nm); the material of the intermediate layer is Cu (about 7 μm); the material of the protective layer is Ag (about 5 μm).
[0037] A method for improving the binding force of plastic coatings, comprising the steps of:
[0038] 1. Injection molding: use a high-speed injection molding machine to inject the base material into an injection mold with a pre-roughened surface to a certain roughness (surface roughness is 1 μm, 3 μm and 5 μm), and obtain injection molded parts with different roughness (Surface roughness is 3 μm, 5 μm and 7 μm).
[0039] 2. Electroless plating: Electroless plating is performed on the surface of injection molded parts to obtain a seed layer.
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Embodiment 2
[0045] The difference from Example 1 is that the base material is a glass fiber reinforced polyphenylene sulfide composite material, wherein the glass fiber content is 40%, the bottom layer material of the seed layer is Cr (about 50nm), and the material of the outer layer is Cu (about 250nm ); the material of the intermediate layer is Cu (about 7 μm); the material of the protective layer is Au (about 2 μm).
Embodiment 3
[0047] The difference with Example 1 is: the base material is a glass fiber reinforced syndiotactic polystyrene composite material, wherein the glass fiber content is 40%, the bottom layer material of the seed layer is NiCu alloy (about 50nm), and the outer layer material is Cu ( about 250nm); the intermediate layer material is Cu (about 7μm); the protective layer material is Sn (about 5μm).
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