Microwave module integration design method, and microwave module produced by using method

Abstract

The invention discloses a microwave module integration design method, and a microwave module produced by using the method, and relates to the field of communication equipment. The method comprises the following steps: preparing components, manufacturing a radio frequency microwave part, manufacturing a low and medium frequency part and a direct current bias part, and assembling the module. Epoxy dielectric plates with different thicknesses are processed into special shapes by means of circuit board processing, mixed pressing, forming and copper coating processing technologies, and are combined into an expected design shape by means of a sintering assembly technology to be used as a bearing body of a unit electrical performance circuit board to replace a metal structural part, so that the use of metal materials can be reduced to a certain extent, and the processing cost of the metal part is reduced.

Description

technical field [0001] The invention belongs to the field of communication equipment, and in particular relates to an integrated design method of a microwave component and a microwave component produced by applying the method. Background technique [0002] With the further development of the current microwave technology, the miniaturization and high integration requirements of microwave products are getting higher and higher. Within the limited volume, more comprehensive functions must be integrated as much as possible to ensure that the product can be reduced in size as much as possible. While the weight and cost are limited, it can exert greater performance within limited conditions. [0003] For the current microwave products, most of them are composed of metal structural parts, single-layer dielectric boards or mixed-pressure dielectric boards, chips and packaging components. The product structure idea is generally as follows: [0004] 1. As the structural main body of...

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Problems solved by technology

[0008] The characteristics of the above design ideas are that the structural parts have better shielding effect and the product has higher firmness. In the bomb-loaded and airborne environment, it has the advantages of low deformation rate, strong impact resistance and stable performance; however, due to the structural parts of the product The specific gravity is high, and the space occupied in the volume is also relatively large. Correspondingly, the size of the circuit board is limited, and it cannot be realized with a single-layer circuit arrangement. The circuit board needs to be made into a multi-layer mixed voltage form. Integrated in a unit circuit board, the signal and DC interconnection between each unit circuit is carried out by using micro-connectors, which will inevitably lead to an increase in the cost of product structural parts and circuit board processing. At the same time, due to the extensive use of micro-shaped connectors, bring about a further increase in cost

For non-missile, airborne, even civilian vehicles, and other conditions that do not have strict requirements for the use environment, this design idea does not have a cost advantage, and the difficulty of assembly is high, and it is not manufacturable

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