Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-extensibility electrolytic copper foil and preparation method thereof

An electrolytic copper foil, high extensibility technology, applied in the direction of electrolysis, electroforming, manufacturing tools, etc., can solve the problems of copper foil ductility, strength and cost can not be balanced, to achieve low production cost, high tensile strength, easy-to-achieve effects

Active Publication Date: 2021-11-09
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the existing problem in the prior art that the ductility, strength and cost of copper foil for flexible copper clad laminates cannot be balanced, the present invention provides a high-extensibility electrolytic copper Foil and its preparation method, through the design principle of "introducing coherent twin interface to reduce surface weakening effect", first obtain nano-twinned copper foil by DC electrodeposition preparation technology, and then anneal to obtain large grain size and contain twin High elongation copper foil for wafer layer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-extensibility electrolytic copper foil and preparation method thereof
  • High-extensibility electrolytic copper foil and preparation method thereof
  • High-extensibility electrolytic copper foil and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The method for preparing (111) textured high-extensibility electrolytic copper foil in this example is as follows: firstly, nano-twinned copper foil is prepared by DC electrodeposition technology, and then nano-twinned copper foil is annealed. The specific process is as follows:

[0035] 1. Preparation of nano-twinned copper foil by DC electrodeposition technology:

[0036] Electrolytic deposition equipment: DC stabilized voltage and stabilized current power supply;

[0037] Electrolyte composition for electrolytic deposition: CuSO 4 100g / L, analytical pure gelatin 40mg / L, HCl 40 mg / L, use deionized water to prepare electrolyte, use analytical pure H 2 SO 4 Adjust the pH of the electrolyte to 1.

[0038] The anode and cathode are iridium tantalum titanium plate and pure titanium plate respectively.

[0039] Electrolytic deposition process parameters: DC electrolytic electroplating copper foil, the current density is 30mA / cm 2 The distance between the cathode and th...

Embodiment 2

[0046] The difference from Example 1 is:

[0047] Annealing conditions: the annealing temperature is 450° C., and the annealing time is 10 minutes.

[0048] The prepared high-extensibility electrolytic copper foil has a thickness of 11.7 μm measured by the weighing method, and is characterized in that: the average number of crystal grains distributed along the thickness direction of the copper foil is 6.3, and the copper foil is paralleled by the intercept method. The surface statistical grain size, the average grain size is 1.1 microns, the ratio of thickness to grain size is 10.6. There is a twinned lamellar structure inside the grain, and the average thickness of the twinned lamellar layer is 0.3 microns obtained by statistics of the perpendicular direction of the twinned grain boundary by the intercept method, as shown in Figure 4 shown.

[0049] The prepared electrolytic copper foil has a strong (111) texture, such as figure 2 Shown in curve 2.

[0050] In this exampl...

Embodiment 3

[0052] The difference from Example 1 is:

[0053] Annealing conditions: the annealing temperature is 500° C., and the annealing time is 10 minutes.

[0054] The prepared electrolytic copper foil has a thickness of 12.4 μm measured by the weighing method, and is characterized in that: the average number of crystal grains distributed along the thickness direction of the copper foil is 2.4, and the crystal grains are counted parallel to the surface of the copper foil by the intercept method. Grain size, the average grain size is 5.0 microns, and the ratio of thickness to grain size is 2.5. There is a twinned crystal layer structure inside the grain, and the average twinned crystal layer thickness is 0.74 microns obtained by statistics of the perpendicular direction of the twinned grain boundary by the intercept method, as shown in Figure 5 shown.

[0055] The prepared electrolytic copper foil has a strong (111) texture, such as figure 2 Shown in curve 3.

[0056] In this ex...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Average grain sizeaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a high-extensibility electrolytic copper foil and a preparation method thereof, and belongs to the technical field of preparation of electrolytic copper foils for copper-clad plates. The preparation method comprises the following steps: firstly, preparing a nano twin-crystal copper foil through a direct-current electrolytic deposition technology, and then annealing the nano twin crystal copper foil to obtain the high-extensibility electrolytic copper foil, wherein the thickness of the high-extensibility electrolytic copper foil is controllable and adjustable in a range of 3-100 microns. The electrolytic copper foil has one or more crystal grains along the thickness direction, and the size range of the crystal grains is 0.5-20 microns; and one or more twin-crystal lamellas exist in the crystal grains. When the thickness of the electrolytic copper foil is 12 microns, the elongation of the electrolytic copper foil is as high as 15%, the tensile strength is 191MPa, and the electrolytic copper foil has a relatively good application prospect in the field of flexible copper-clad plates.

Description

technical field [0001] The invention relates to the technical field of preparation of electrolytic copper foil for copper-clad laminates, in particular to a high-extensibility electrolytic copper foil and a preparation method thereof. Background technique [0002] Copper foil is one of the key basic materials of modern industry. According to the application, it is mainly divided into copper foil for copper clad laminate (PCB) and copper foil for ion battery. Copper clad laminate is the "nerve" of electronic components, and copper foil is the key material of copper clad laminate, which plays a supporting role in electronic components. With the rapid development of society, electronic equipment is gradually developing in the direction of popularization, intelligence, miniaturization, and flexibility, and the demand and performance requirements for copper foil are getting higher and higher. China's copper foil production has increased rapidly. By 2017, China's copper foil prod...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D1/04C25D3/38C25D7/06C21D1/26C21D1/74C21D9/46C22F1/08C22F1/02
CPCC25D1/04C25D3/38C25D7/0614C22F1/08C22F1/02C21D9/46C21D1/26C21D1/74Y02E60/10
Inventor 卢磊程钊金帅
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com