MINI LED packaging substrate and surface treatment method thereof

Abstract

The invention provides a MINI LED packaging substrate and a surface treatment method thereof. The surface treatment method of the MINI LED packaging substrate comprises the following steps of carrying out double-sided copper-clad operation on a resin substrate to obtain a double-sided copper-clad plate, respectively manufacturing a front circuit and a back circuit on two sides of the double-sided copper-clad plate to form a copper-clad plate circuit, arranging a circuit bonding pad on the copper-clad plate circuit, performing tin spraying operation on one surface of the circuit bonding pad, and plating an anti-oxidation layer on the other surface of the circuit bonding pad, attaching the anisotropic conductive adhesive to the circuit bonding pad, bonding the MINI LED chip on the surface of the anisotropic conductive adhesive, and performing reflow soldering operation on the MINI LED chip and the circuit bonding pad. The MINI LED packaging substrate obtained through the surface treatment method of the MINI LED packaging substrate is low in cost and good in environmental protection performance, the packaging mode is easy to operate, and micro short circuit of the positive electrode and the negative electrode can be prevented.

Description

technical field [0001] The invention relates to the technical field of packaging substrate manufacturing, in particular to a MINI LED packaging substrate and a surface treatment method thereof. Background technique [0002] With the launch of more new products carrying MINI LEDs, this technology is at a critical point in its implementation, and many new technologies and variables have emerged in terms of chip, package and substrate selection. At present, the substrate lines used for MINI LED packaging are all copper foil, and the surface of the copper foil is easy to oxidize. At the same time, in order to facilitate wire bonding, the surface of the copper foil of the substrate needs to be electroplated, such as gold-plated, silver-plated, nickel-plated, etc., so that it is not easy to protect the copper foil. It is oxidized by air and easy to solder wire. [0003] However, metals such as gold and silver in traditional electroplating methods are very expensive, resulting in ...

AI Technical Summary

Problems solved by technology

At present, the substrate circuits used for MINI LED packaging are all copper foil, and the surface of the copper foil is easily oxidized. At the same time, in order to facilitate wire bonding, the surface of the copper foil of the substrate needs to be electroplated, such as gold-plated, silver-plated, nickel-plated, etc., so that it is not easy to protect the copper foil. Oxidized by air and easy to solder

[0003] However, metals such as gold and silver in traditional electroplating methods are very expensive, resulting in very high product costs

Moreover, the substrate takes a long time in the electroplating process, the production efficiency is not high, the energy consumption of the whole process is high, and more waste water will be generated after the electroplating is completed, which is easy to pollute the environment

In addition, the packaging operation of the traditional MINI LED substrate is more complicated, and the MINI LED chip and the circuit pad are prone to micro-short circuit during the packaging process.

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