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Organic gold conductor paste

A gold conductor and organic carrier technology, which is applied in the field of organic gold conductor paste to achieve the effects of reducing square resistance, improving adhesion and scratch resistance, and compacting and flattening roughness.

Active Publication Date: 2021-11-16
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its conductivity, adhesion and scratch resistance need to be further improved, so as to better meet the development needs of application products

Method used

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  • Organic gold conductor paste

Examples

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Effect test

preparation example Construction

[0015] Preparation of organic vehicle: Mix 80g terpineol and 20g epoxy resin NPEL-127 together, heat in a water bath to 80°C, stir continuously until the solution is completely dissolved and in a uniform state, then stop heating; cool at room temperature for 24 hours and store for use.

[0016] Synthesis of gold resinate: dissolve gold trichloride with an acidity of 8% in isopropanol to obtain a solution with a gold trichloride content (weight ratio) of 30%, and pour the above solution into a 10% sulfur Sulfurized balsam, made a solution with a molar ratio of gold and sulfur of 1:0.1, stirred and reacted the solution at a temperature of 80°C for 8 hours, washed and precipitated crystals with isopropanol after the reaction, reduced pressure to 0.8 atmospheres, distilled and dried 1.5 Hours, the dark brown paste-like vulcanized balsam gold compound, namely gold resinate, is finally obtained, which is stored for later use.

Embodiment 1

[0020] Get 40g of gold resinate, 1g of lead octoate, 2g of bismuth 2-hexyl hexane, 0.1g of rhodium octoate, 2g of silicon 2-ethylhexanoate, 1g of vanadium isooctanoate, 2g of trimethyl boron, 50.9g of organic carrier, oily gold Nano-solution (diameter 5nm) 1g, stirred by high-speed disperser, fully dispersed by three rollers, vacuum defoaming, to obtain organic gold conductor slurry.

Embodiment 2

[0022] Get 40g of gold resinate, 1g of lead octoate, 2g of bismuth 2-hexyl hexane, 0.1g of rhodium octoate, 2g of silicon 2-ethylhexanoate, 1g of vanadium isooctanoate, 2g of trimethyl boron, 49.4g of organic carrier, oily gold 2.5g of nanometer solution (diameter 5nm) was stirred by a high-speed disperser, fully dispersed by three rollers, and vacuum defoamed to obtain an organic gold conductor slurry.

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PUM

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Abstract

The invention discloses organic gold conductor paste which comprises the following components in percentage by mass: 40%-60% of resin acid gold, 2%-10% of a metal organic matter mixing agent, 30%-60% of an organic carrier and 1%-4% of an oily gold nano solution, wherein the resin acid gold is prepared by reacting sulfurized balsam and gold trichloride; the metal organic matter mixing agent is a mixture of lead caprylate, bismuth 2-hexylhexane, rhodium caprylate, silicon 2-ethylhexanoate, vanadium iso-octoate and trimethyl boron; the concentration of gold in the oily gold nano solution is 40-60 mug / mL, and the diameter is 5-40 nm. By adding the oily gold nano solution, the sheet resistance of the conductor paste is greatly reduced, the adhesive force and the scratch resistance are improved, meanwhile, a sintered film is compact and flat in surface, low in roughness, resistant to acid and alkali, bright yellow and free of light leakage, the roughness Ra is lower than 0.05 mum, the sheet resistance is about 20 momega / square, the adhesive force reaches 64 N / mm<2> or above, and the scratch resistance reaches 3B.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to an organic gold conductor paste whose sintered film has a dense and smooth surface, acid and alkali resistance, low square resistance, high adhesion and strong scratch resistance. Background technique [0002] With the rapid development of intelligent and informatization-related industries, the upstream industry chain of electronic components has grown rapidly, and the market scale has continued to expand. Among them, the global scale of the thermal printer market has reached 40.9 billion US dollars in 2019, and it has not been affected by the market. The impact of the global new crown epidemic has maintained a rapid growth momentum. [0003] Thermal print head is one of the key materials of thermal printing equipment. Japan’s Seiko (SEKIO), Fujitsu (FUJITSU) and other companies occupy most of the global market and are technology leaders. Domestic companies S...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22B41J2/335
CPCH01B1/22B41J2/3355
Inventor 兰金鹏苏亚军汪冲鹿宁陈向红
Owner 西安宏星电子浆料科技股份有限公司
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