Organic light-emitting diode frit glue packaging structure and manufacturing method thereof

Abstract

The invention discloses an organic light-emitting diode frit glue packaging structure and a manufacturing method thereof. The organic light-emitting diode frit glue packaging structure comprises a cover plate, a micro-nano thin layer and frit glue, wherein the micro-nano thin layer is arranged on the cover plate, and the frit glue is arranged on the micro-nano thin layer. The invention belongs to the technical field of semiconductor packaging, and particularly relates to the organic light-emitting diode frit glue packaging structure and the manufacturing method thereof. A micro-nano thin layer is added on the surface of the cover plate, and the combination surface of the frit glue and the cover plate is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor encapsulation, and specifically refers to an organic light emitting diode frit encapsulation structure and a manufacturing method thereof. Background technique [0002] Organic Light Emitting Diode (OLED) OLED display has the characteristics of low power consumption, wide viewing angle, wide color gamut, fast response speed, ultra-light and thin, etc. In the high-performance display area, it is developing more and more as an autonomous light-emitting device. faster; [0003] At present, the packaging methods used by OLED devices can be divided into two types, rigid and flexible. Among them, small rigid screens mainly adopt frit packaging, and frit packaging needs to rely on screen printing to print the glue on the glass cover, and then pre-sintering to remove The organic solvent in the colloid melts the glass powder in the colloid into pieces and sticks together with the cover glass, and fi...

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Problems solved by technology

[0003] At present, the packaging methods used by OLED devices can be divided into two types, rigid and flexible. Among them, small rigid screens mainly adopt frit packaging, and frit packaging needs to rely on screen printing to print the glue on the glass cover, and then pre-sintering to remove The organic solvent in the colloid melts the glass powder in the colloid into pieces and sticks together with the cover glass, and finally combines with the TFT substrate coated with OLED devices through laser sintering, so as to achieve the purpose of packaging, but the frit glue and the cover plate Once defects appear between them, the combined interface will become fragile, resulting in interface peeling or micro-cracks, then water and oxygen will diffuse into the screen along the defects or micro-cracks, because OLED devices are extremely sensitive to water and oxygen , once it reacts with water and oxygen, it will fail and cannot be lit

[0004] When screen printing, it is often hoped that the glue material has better fluidity to prevent the glue shape from being saddle-shaped with a low center and high sides, but good fluidity can easily lead to a flat glue flow, making the glue width too wide and the glue height too low; Moreover, after the untreated smooth cover glass surface is combined with frit, there is still a fragile interface, which is prone to peeling and cracking due to the existence of its own defects and the action of external forces, resulting in the intrusion of water and oxygen, which leads to the failure of OLED devices.

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