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PCB winding device and power supply module

A power module, PCB board technology, applied in the direction of transformer/inductor cooling, transformer/inductor parts, transformer/inductor coil/winding/connection, etc., can solve the problem of wasting the available layers of PCB board, and achieve simplification Structure and process, solve heat accumulation, improve the effect of heat conduction efficiency

Pending Publication Date: 2021-11-26
捷蒽迪电子科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to solve the above-mentioned technical defects in the prior art, the present invention proposes a PCB winding device and a power module, which solves the problem of wasting the available layers of the PCB board in the prior art, and simplifies the structure and process difficulty

Method used

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  • PCB winding device and power supply module
  • PCB winding device and power supply module
  • PCB winding device and power supply module

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Experimental program
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Effect test

Embodiment 1

[0038] Such as Figure 4 As shown, the PCB transformer adopting the concept of the present invention includes: a main PCB multilayer board 1 and a secondary PCB multilayer board 2, a transformer magnetic core 3, and a transformer magnetic core 4, wherein the main PCB multilayer board 1 is used as the first A PCB board, and the sub-PCB multilayer board 2 serves as the second PCB board.

[0039] The main PCB multilayer board 1 and the auxiliary PCB multilayer board 2 are used to form a transformer winding, wherein the main PCB multilayer board 1 is used to form a part of the transformer winding, and the auxiliary PCB multilayer board 2 is used to form another part of the transformer winding. It should be noted that the windings formed on the main PCB multilayer board 1 and the windings formed on the auxiliary PCB multilayer board 2 do not need to be strictly differentiated according to the primary winding or the secondary winding. In some embodiments, the complete primary windi...

Embodiment 2

[0047] The difference between this embodiment and Embodiment 1 and Embodiment 2 is that since there is no need to consider the short circuit problem between the main PCB multilayer board and the secondary PCB multilayer board, in this embodiment, the first copper foil layer 5 and the second The solder resist layer provided on the surface of the copper foil layer 8 does not need to be removed. When the main PCB multilayer board 1 and the auxiliary PCB multilayer board 2 are assembled, the pads are still used to fix the main PCB multilayer board 1 and the auxiliary PCB multilayer board 2, and the solder resist layer on the first copper foil layer 5 and the second copper foil layer The solder resist layer on the foil layer 8 is arranged adjacently with a certain gap, or the solder resist layer on the first copper foil layer 5 and the solder resist layer on the second copper foil layer 8 are arranged in close contact. The gaps left by adjacent solder mask layers can be used as hea...

Embodiment 3

[0050] The concept of the present invention can also realize PCB inductance, and the specific implementation method is roughly the same as the aforementioned PCB transformer implementation, including the main PCB multilayer board and the auxiliary PCB multilayer board, but no magnetic core is required.

[0051] The main PCB multilayer board and the auxiliary PCB multilayer board are respectively used to form a part of the inductor winding, the main PCB multilayer board forms the first winding, the auxiliary PCB multilayer board forms the second winding, the main PCB multilayer board and the auxiliary PCB multilayer board After the boards are combined, the first winding and the second winding form a complete inductor. Wherein, the outermost copper foil layers on the side facing each other of the main PCB multilayer board and the auxiliary PCB multilayer board are used to form windings, and the electrical properties of the first winding and the second winding are the same.

[00...

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Abstract

The invention relates to a PCB winding device and a power module. The PCB winding device is provided with a first winding, a second winding, a first PCB and a second PCB, and at least one of the first PCB and the second PCB is a multi-layer PCB; the first PCB comprises a first circuit layer located on the outermost layer of one side of the first PCB, and the second PCB comprises a second circuit layer located on the outermost layer of one side of the second PCB; the first PCB is used for forming a first winding, and the first circuit layer forms at least one part of the first winding; the second PCB is used for forming a second winding, and the second circuit layer forms at least one part of the second winding; and the first circuit layer and the second circuit layer are oppositely arranged, and the first winding and the second winding have the same electrical property. According to the invention, an insulating plate does not need to be additionally arranged between the first PCB and the second PCB, so that the heat conduction efficiency is improved, and the waste of the space of the multi-layer PCB is avoided.

Description

technical field [0001] The invention belongs to the technical field of module power supplies, and in particular relates to a PCB winding device and a power supply module. Background technique [0002] PCB consists of circuit layer, thermal insulation layer and metal base layer. The circuit layer (usually a copper foil layer) is etched to form a printed circuit that interconnects the various components of the assembly. In general, the circuit layer requires a large current-carrying capacity, so thicker copper foil is used. In the power module, the printed circuit board (PCB) is the key component. It carries other electronic components and connects the circuit to provide a stable circuit working environment. Common PCB boards have a double-layer structure. With the development of power electronics technology towards high power, the number of layers of PCB boards also increases, that is, PCB multilayer boards include multi-layer circuit layers (printed boards), and each layer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/28H01F27/22H05K1/14H05K1/16H02M1/00
CPCH01F27/2804H01F27/2876H01F27/22H05K1/165H05K1/144H05K1/145H02M1/00H01F2027/2809
Inventor 李博
Owner 捷蒽迪电子科技(上海)有限公司
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