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Epoxy resin composition, curable resin composition, cured product, and adhesive

A technology of curable resin and epoxy resin, applied in the field of epoxy resin composition, can solve the problems of low glass transition point, easy drop of epoxy resin dispersibility, etc., and achieve the effect of excellent impact resistance

Pending Publication Date: 2021-11-26
MITSUBISHI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] However, the rubber-containing polymer in Patent Document 1 has no cross-linked structure, so in the process of producing the epoxy resin containing the rubber-containing polymer, the particles of the rubber-containing polymer are bound to each other, and the dispersibility in the epoxy resin is easy. falling problem
[0013] Since the glass transition point of the outermost layer of the rubber-containing polymer of Patent Document 2 is low, in the process of producing the epoxy resin containing the rubber-containing polymer, there is adhesion between particles of the rubber-containing polymer, and the epoxy resin The problem that the dispersion in the

Method used

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  • Epoxy resin composition, curable resin composition, cured product, and adhesive
  • Epoxy resin composition, curable resin composition, cured product, and adhesive
  • Epoxy resin composition, curable resin composition, cured product, and adhesive

Examples

Experimental program
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Effect test

Embodiment 1

[0426] (Manufacture of rubber-containing polymers)

[0427] In the reaction vessel, 80 parts of rubber latex and 0.2 parts of sodium alkyl diphenyl ether sulfonate were put into the reaction vessel, and after the internal temperature was raised to 70° C., 0.3 parts of sodium formaldehyde sulfoxylate dissolved in 10 Aqueous solutions obtained in deionized water. While maintaining the internal temperature at 70°C, a monomer mixture (mixture of monomers forming the vinyl monomer portion) separately prepared with the composition shown in Table 2 was added dropwise over 120 minutes, and then kept for 60 minutes to carry out polymerization to obtain rubber polymer.

[0428] (Volume average particle diameter of rubber-containing polymer)

[0429] For the rubber-containing polymer latex, the volume average particle diameter was measured using a laser diffraction / scattering particle size distribution analyzer (manufactured by HORIBA, LA-960).

[0430] (manufacturing of premix)

[0...

Embodiment 2～12、 comparative example 1～3

[0451] In the production of the rubber-containing polymer in Example 1, the same operation as in Example 1 was performed except that the composition of the monomer mixture to be polymerized was changed as shown in Table 2 or Table 3. The evaluation results are shown in Table 2 and Table 3.

[0452] [Table 2]

[0453]

[0454] [table 3]

[0455]

[0456] The abbreviations in Table 2 and Table 3 have the following meanings, respectively.

[0457] Bd: a butadiene-based rubbery polymer.

[0458] MMA: methyl methacrylate.

[0459] GMA: glycidyl methacrylate.

[0460] St: Styrene.

[0461] AMA: Allyl methacrylate.

[0462] 13BD: 1,3-Butanediol dimethacrylate.

[0463] CYM100: CYCLOMER 100 (manufactured by Daicel, alicyclic epoxy group-containing methacrylate)

[0464] 16HX: 1,6-hexanediol dimethacrylate

[0465] TPeel: Evaluation result of peel strength.

[0466] IWP: Evaluation result of impact resistance (dynamic breaking resistance value).

[0467] In Table 2 and...

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Abstract

The purpose of the present invention is to provide: an epoxy resin composition and a curable resin composition that provide a cured product in which a rubber-containing polymer is well dispersed in epoxy resin and which has an excellent impact resistance; and a cured product from the epoxy resin composition and the curable resin composition. An epoxy resin composition according to the present invention contains a rubber-containing polymer and an epoxy resin, wherein the rubber-containing polymer contains at least one rubbery polymer and at least one vinyl monomer part. The vinyl monomer part includes a unit based on monomer (a), a unit based on monomer (b), and a unit based on monomer (c), where monomer (a) is a polyfunctional (meth)acrylate; monomer (b) is at least one monomer selected from the group consisting of epoxy group-containing (meth)acrylates and aromatic vinyl monomers; and monomer (c) is an alkyl (meth)acrylate.

Description

technical field [0001] The present invention relates to an epoxy resin composition, a curable resin composition, a cured product, and an adhesive. [0002] This application claims priority based on Japanese Patent Application No. 2019-080298 filed in Japan on April 19, 2019, the contents of which are incorporated herein by reference. Background technique [0003] The cured product of the epoxy resin is excellent in heat resistance, electrical characteristics, durability, and the like. Therefore, epoxy resin compositions containing epoxy resins and their curing agents are used in structural adhesives for vehicles, adhesives for civil engineering / construction, adhesives for electronic materials, adhesives for industrial use, and molding materials. and other uses. [0004] Since the cured product of epoxy resin is brittle, there are problems of poor impact resistance and adhesive strength. Therefore, conventionally, a thermoplastic resin, a rubber component, and the like hav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20C08L51/04C08L63/00
CPCC08L51/04C08L63/00C08G59/20C08F220/1804C08F279/02C08F220/20C08F236/06C08F212/08C08F220/14C08F220/325C08L33/06C08F222/102C08F2/22C08F2/38C08F283/12C08G59/245C08G59/4021C08G2170/00C08L2205/03C08L2205/22C08L2207/53
Inventor 尾野本广志小高一义大谷刚上村以帆
Owner MITSUBISHI CHEM CORP