High-sensitivity micro-pressure detection capacitive micro-mechanical ultrasonic transducer with annular groove vibrating diaphragm structure
A capacitive micromechanical and ultrasonic transducer technology, applied in the directions of microstructure technology, microstructure device, microelectronic microstructure device, etc., to achieve the effect of improving sensitivity and ensuring accuracy
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[0028] High-sensitivity micro-pressure detection capacitive micro-mechanical ultrasonic transducer with annular groove diaphragm structure, its overall structure includes metal upper electrode 1, Si diaphragm 2, SiO 2 Support column 3, vacuum chamber 4, SiO 2 Insulating layer 5 and low-resistivity silicon substrate (also the lower electrode); specific preparation process: first, the prepared SOI wafer and high-quality Si wafer are cleaned by RCA to remove surface insoluble pollutants; Engraving and inductively coupled plasma deep silicon etching process define the shape and depth of the cavity on the high-quality Si wafer, and then form a silicon dioxide insulating layer through dry oxygen oxidation; secondly, after bonding the SOI and the processed Si wafer, Use dry and wet etching processes to remove the buried oxide layer and substrate of SOI, thereby releasing the top silicon to form a diaphragm; again, use photolithography and magnetron sputtering processes to define the ...
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