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High-sensitivity micro-pressure detection capacitive micro-mechanical ultrasonic transducer with annular groove vibrating diaphragm structure

A capacitive micromechanical and ultrasonic transducer technology, applied in the directions of microstructure technology, microstructure device, microelectronic microstructure device, etc., to achieve the effect of improving sensitivity and ensuring accuracy

Active Publication Date: 2021-11-30
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The Si diaphragm of the traditional capacitive micromachined ultrasonic transducer is a flat diaphragm. The diaphragm and the cylindrical cavity structure severely limit the deformation of the diaphragm and inhibit the further optimization of pressure measurement performance.

Method used

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  • High-sensitivity micro-pressure detection capacitive micro-mechanical ultrasonic transducer with annular groove vibrating diaphragm structure
  • High-sensitivity micro-pressure detection capacitive micro-mechanical ultrasonic transducer with annular groove vibrating diaphragm structure
  • High-sensitivity micro-pressure detection capacitive micro-mechanical ultrasonic transducer with annular groove vibrating diaphragm structure

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Embodiment Construction

[0028] High-sensitivity micro-pressure detection capacitive micro-mechanical ultrasonic transducer with annular groove diaphragm structure, its overall structure includes metal upper electrode 1, Si diaphragm 2, SiO 2 Support column 3, vacuum chamber 4, SiO 2 Insulating layer 5 and low-resistivity silicon substrate (also the lower electrode); specific preparation process: first, the prepared SOI wafer and high-quality Si wafer are cleaned by RCA to remove surface insoluble pollutants; Engraving and inductively coupled plasma deep silicon etching process define the shape and depth of the cavity on the high-quality Si wafer, and then form a silicon dioxide insulating layer through dry oxygen oxidation; secondly, after bonding the SOI and the processed Si wafer, Use dry and wet etching processes to remove the buried oxide layer and substrate of SOI, thereby releasing the top silicon to form a diaphragm; again, use photolithography and magnetron sputtering processes to define the ...

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Abstract

The invention relates to the field of micro-pressure (0-10kPa) detection, particularly relates to an MEMS or capacitive micro-mechanical ultrasonic transducer, in particular to a high-sensitivity micro-pressure detection capacitive micro-mechanical ultrasonic transducer with an annular groove vibrating diaphragm structure. The transducer comprises a metal upper electrode, a Si vibrating diaphragm, a SiO2 supporting column, a vacuum cavity, a SiO2 insulating layer and a silicon substrate, and the annular SiO2 supporting column is arranged at the edge position of the lower portion of the Si vibrating diaphragm. A silicon substrate is arranged below the SiO2 supporting column, a cavity defined by the Si vibrating diaphragm, the SiO2 supporting column and the silicon substrate is a vacuum cavity, the SiO2 insulating layer is arranged at the bottom of the vacuum cavity, the metal upper electrode is sputtered above the Si vibrating diaphragm, and a plurality of concentric annular grooves are etched in the upper surface of the Si vibrating diaphragm. The capacitive micro-mechanical ultrasonic transducer has the pressure detection performance of high sensitivity and excellent linearity.

Description

technical field [0001] The invention relates to the field of micro-pressure (0-10kPa) detection, in particular to a MEMS or capacitive micro-machine ultrasonic transducer, in particular to a high-sensitivity micro-pressure detection ring-groove diaphragm structure capacitive micro-machine ultrasonic transducer. Background technique [0002] Pressure is the most basic application parameter, and its precise measurement is an urgent technical problem in the fields of industrial production, scientific research, national defense technology, and biomedicine. Especially in the micro-pressure environment, efficiently and accurately obtaining weak pressure is always one of the key technologies and difficulties in the design of pressure sensors; coupled with complex situations such as sudden pressure changes, it is necessary to design a practical sensor with high sensitivity and low detection. It is quite difficult. Nevertheless, micro-pressure sensors have always been a research hot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/02B81B7/02
CPCB06B1/02B81B7/02B81B2201/03
Inventor 王红亮丁琦何常德张文栋黄霄王任鑫王智豪
Owner ZHONGBEI UNIV