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Antimony-containing soldering-flux-free solder wire and preparation method thereof

A solder wire and flux technology, used in welding equipment, manufacturing tools, welding media, etc., can solve the problems of not being completely decomposed, affecting product life, solder joint corrosion, etc., to improve life and reliability, and improve thermal and electrical conductivity. rate, the effect of reducing the soldering temperature

Active Publication Date: 2021-12-10
浙江强力控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because of the existence of organic acid activators, such activators are not easy to completely decompose during high-speed welding, and remain on the surface of the weldment together with rosin, and the active components in the residue are extremely vulnerable to high temperature or humid environments. It is easy to chemically react with weldments or solder joints, resulting in continuous corrosion of solder joints, thus affecting product life

Method used

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  • Antimony-containing soldering-flux-free solder wire and preparation method thereof
  • Antimony-containing soldering-flux-free solder wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An antimony-containing flux-free solder wire includes 10% of the first component and 90% of the second component in terms of mass percentage.

[0019] Weigh the first component of 4Kg of dibasic acid ester and 6Kg of antimony-copper compound powder, with a median particle size of 1.0 microns;

[0020] Weigh 100Kg of electrolytic tin whose purity of the second component is 99.95%;

[0021] Its preparation method comprises the following steps:

[0022] Step 1, mixing the dibasic acid ester and antimony-copper compound powder in the first component evenly, heating to 90-105°C, and keeping stirring continuously to obtain the first component;

[0023] Step 2: Pour the above-mentioned homogeneously mixed first component into an injection barrel with heat preservation and stirring functions for later use;

[0024] Step 3, put the above-mentioned weighed second component of electrolytic tin into an intermediate frequency heating furnace, keep the temperature range of 380-400°...

Embodiment 1

[0027] Step 6, the extruded product is passed through a wire drawing die to control the thickness of the wire diameter, and the final wire diameter is 1.5mm, that is, the antimony-containing flux-free solder wire of the present invention is obtained as the sample of Example 1 for testing.

Embodiment 2

[0029] An antimony-containing flux-free solder wire includes 15% of the first component and 85% of the second component in terms of mass percentage.

[0030] Weigh the first component of 6Kg of dibasic acid ester and 9Kg of antimony copper compound powder, particle size is 1.0 micron;

[0031] Weigh 100Kg of electrolytic tin whose purity of the second component is 99.95%;

[0032] Its preparation method comprises the following steps:

[0033] Step 1, mixing the dibasic acid ester and antimony-copper compound powder in the first component evenly, heating to 90-105°C, and keeping stirring continuously to obtain the first component;

[0034] Step 2: Pour the above-mentioned homogeneously mixed first component into an injection barrel with heat preservation and stirring functions for later use;

[0035] Step 3, put the above-mentioned weighed second component of electrolytic tin into an intermediate frequency heating furnace, keep the temperature range of 380-400°C, and continue...

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Abstract

The invention discloses an antimony-containing soldering-flux-free solder wire and a preparation method thereof. The antimony-containing soldering-flux-free solder wire comprises the following components in percentage by mass: 10-20% of a first component and 80-90% of a second component, wherein the first component is composed of 40-60% of dibasic acid ester and 60-40% of antimony-copper compound powder, and the granularity of the antimony-copper compound powder is 0.8-1.2 microns; and the second component is electrolytic tin with the purity of 99.95%. According to the obtained soldering-flux-free solder wire, the main component of an intermetallic compound formed by a soldered joint during traditional soldering is adopted as part of a solder wire alloy and is fused with tin solder through a certain process, soldering-flux-free soldering is achieved, it is guaranteed that there is basically no residue after soldering, the soldering form is good, the soldering strength is high, and a traditional rosin type solder wire can be completely met and replaced. A novel material is provided for the electronic welding industry, the application scenarios are wider, and the application reliability is higher.

Description

technical field [0001] The invention relates to a flux-free solder wire used in the technical field of electronic welding production, in particular to a flux-free solder wire containing antimony and a preparation method thereof. Background technique [0002] Solder wire is the main welding material for assembly in the electronic welding industry. It must first ensure the quality and reliability of welding, and its quality directly affects the service life of the assembled product. [0003] At present, the solder wire used in the electronic industry at home and abroad must be assisted by a certain amount of flux to complete the welding process. It is necessary whether the flux is built into the solder wire or coated with flux during the welding process. The main component of the flux is Most of them are rosin-based fluxes and various organic acid activators. Because of the existence of organic acid activators, such activators are not easy to completely decompose during high-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/262B23K35/40B23K35/36
Inventor 黄鲁江夏杰赵图强
Owner 浙江强力控股有限公司
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