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Novel mxenes polymer dielectric composite material and preparation process thereof

A composite material and preparation process technology, applied in the direction of synthetic resin layered products, lamination, layered products, etc., can solve the problem of not showing characteristics, achieve low dielectric loss, high dielectric constant, improve dielectric constant effect

Active Publication Date: 2021-12-10
SICHUAN COLLEGE OF ARCHITECTURAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, neither organic nor inorganic dielectric materials exhibit all of the above properties

Method used

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  • Novel mxenes polymer dielectric composite material and preparation process thereof
  • Novel mxenes polymer dielectric composite material and preparation process thereof
  • Novel mxenes polymer dielectric composite material and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] The preparation process of a new MXENES polymer dielectric composite material, including the following steps:

[0044] Preparation Ti 3 C 2 T x , Includes the following steps:

[0045] Step A1: 1, mixed TiC, Ti, Al in 0.85: 1.15: 1.05 molar ratio, then warmed to 1400 ° C for 4 hours at a rate of 5 ° C / min for 4 hours to obtain Ti 2 Alc; 2, the molar ratio is 1: 1 Ti 2 Alc and TiC mixed, then heated to 1400 ° C for 2 hours at a rate of 10 ° C / min for 2 hours to give Ti 3 ALC 2 Grinding Ti 3 ALC 2 Powder;

[0046] Step A2: 1, the proportion of 20 ml of HCl and 1G LIF is mixed in an ice bath, and the speed of 400R / min is stirred for about 10 minutes; 2. Slowly will 1G Ti 3 ALC 2 In the HCl-LIF solution, it was still 10 minutes in an ice bath; 3, the mixture was placed in a water bath of 30-40 ° C, stirring the reaction to obtain Ti 3 C 2 Hybrid;

[0047] Step A3: Centrifugation Ti 3 C 2 Mixed liquid gets Ti 3 C 2 Solution;

[0048] Step A4: Put Ti 3 C 2 The solution is p...

Embodiment 2

[0056] Based on Embodiment 1, the difference between the embodiment and the first embodiment is that Ti 3 C 2 T x TI 3 C 2 T x 10% of the total mass of P (VDF-TRFE).

Embodiment 3

[0058] Based on Embodiment 1, the difference between the embodiment and the first embodiment is that Ti 3 C 2 T x TI 3 C 2 T x 12% of the total mass of P (VDF-TRFE).

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Abstract

The invention discloses a novel mxenes polymer dielectric composite material. The dielectric composite material is composed of Ti3C2Tx as a filler and P (VDF-TrFE) as a matrix, and the Ti3C2Tx accounts for 8-12 wt% of the dielectric composite material. The invention relates to a preparation process of the novel mxenes polymer dielectric composite material, which comprises the following steps of: mixing Ti3C2Tx and P (VDF-TrFE), pouring the mixture to form films, and carrying out PC hot pressing on the two films to oobtain the novel mxenes polymer dielectric composite material. By adopting the novel mxenes polymer dielectric composite material and the preparation process, the novel mxenes polymer dielectric composite material has the characteristics of high dielectric constant and low dielectric loss.

Description

Technical field [0001] The present invention relates to a novel polymer dielectric composites mxenes preparation and belongs to the technical field of the dielectric material. Background technique [0002] Since the dielectric material in the energy storage, optoelectronics, energy harvesting, as well as a wide range of applications in many fields of liquid and temperature sensors, etc., and therefore has been of great concern to researchers worldwide. Wherein the combination of high dielectric constant, low dielectric loss and low process temperature flexible dielectric material is ideal. However, whether organic or inorganic dielectric materials can not exhibit all the above characteristics. [0003] MXenes is a transition metal carbides, nitrides and carbonitrides of a material consisting of new series of 2D. Graphene having high specific surface area characteristics, high electrical conductivity, and includes a flexible and adjustable component, the minimum thickness of the n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B37/10B32B27/36B32B27/06B32B33/00C08K3/14C08L27/16
CPCB32B37/06B32B37/10B32B27/365B32B27/06B32B33/00C08K3/14B32B2307/204C08L27/16Y02E60/13
Inventor 李乐毅郏义征
Owner SICHUAN COLLEGE OF ARCHITECTURAL TECH