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Manufacturing method of PCB and PCB

A technique for PCB boards and manufacturing methods, applied in the field of PCB boards, can solve problems such as poor copper sinking effects, achieve the effects of solving poor copper sinking effects, reducing production costs, and ensuring copper sinking effects

Inactive Publication Date: 2021-12-10
广州广合科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for manufacturing a PCB board and a PCB board, which solves the problem of poor copper sinking effect, improves production efficiency and reduces production costs

Method used

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  • Manufacturing method of PCB and PCB
  • Manufacturing method of PCB and PCB
  • Manufacturing method of PCB and PCB

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Embodiment Construction

[0038] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0039] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two ...

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Abstract

The invention relates to the technical field of PCB production, and discloses a manufacturing method of a PCB and the PCB. The PCB is provided with a wiring hole, and the manufacturing method of the PCB comprises the following steps: S1, carrying out impurity removal treatment on the hole wall of the wiring hole, specifically, S11, removing glue residues on the hole wall of the wiring hole by using a glue removal solution; S12, carrying out neutralizing treatment on the PCB after glue removal through a neutralizing solution being a mixed solution of a neutralizing agent and water, the content of the neutralizing agent in the neutralizing solution ranging from 100 mL / L to 140 mL / L; S2, performing activating treatment on the PCB after the impurities are removed by using an activating solution; S3, carrying out reduction treatment on the PCB after the activation treatment; and S4, carrying out copper deposition treatment on the PCB after the reduction reaction is completed, so that a copper layer is deposited on the hole wall of the wiring hole. By improving the neutralization treatment stage in the production process, the problem of poor copper deposition effect is solved, and the production cost is reduced while the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of PCB board production, in particular to a method for manufacturing a PCB board and the PCB board. Background technique [0002] PCB board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. Cross-layer micro-via (Skip via) is one of the implementation methods of blind hole connection between adjacent layers of PCB board. With the continuous development of science and technology, the requirements for line wiring and transmission signals are getting higher and higher. Due to more wiring requirements in the PCB board, the wiring space in the PCB board is insufficient. Based on the design wiring and signal requirements, it is usually Apply cross-layer microvia design to PCB. When producing this type of PCB board, laser drilling and mechanical drilling are generally used. On the lam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/42H05K3/425H05K2203/0783
Inventor 李仕武汤湘平欧阳泽王景贵谢明运
Owner 广州广合科技股份有限公司
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