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Copper core-kovar alloy composite wire for electronic packaging

An electronic packaging and composite wire technology, applied in metal/alloy conductors, cable/conductor manufacturing, conductors, etc., can solve the problems of low bonding strength and air holes, and achieve low cost, high production efficiency, and air tightness. Effect

Pending Publication Date: 2021-12-24
江苏国镍新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above method can improve the electrical conductivity and thermal conductivity of the sealed wire to a certain extent, this mechanical bonding method has low bonding strength, and it is easy to cause air holes between the copper core in the composite material and the Kovar alloy shell. The air leakage rate of the composite interface can only be less than 1×10 - 8 Pa.L / s

Method used

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  • Copper core-kovar alloy composite wire for electronic packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A copper core kovar alloy composite wire for electronic packaging is prepared according to the following steps:

[0045] (1) Clean and dry the steel pipe, put it into a vacuum melting furnace, and keep a high vacuum state in the furnace, with a vacuum degree of 5x10 -4 Pa, the steel pipe is in an upright state in the furnace, and the steel pipe is Kovar 4J49 alloy steel;

[0046] (2) placing the cathode copper into a graphite crucible for heating and melting to form copper liquid;

[0047] (3) Preheat the steel pipe dried in step (1) to 600°C and keep it warm for 2 hours;

[0048] (4) Refining the copper liquid obtained in step (2), pouring it into the steel pipe preheated in step (3) after refining, then cooling down to 300° C. with the furnace, taking out the furnace and cooling to room temperature to obtain a composite ingot;

[0049] (5) shaping the composite billet into an extruded billet;

[0050] (6) the extruded billet is placed in a 500-ton extruder, and ext...

Embodiment 2

[0054]A copper core kovar alloy composite wire for electronic packaging is prepared according to the following steps:

[0055] (1) Clean and dry the steel pipe, put it into a vacuum melting furnace, and keep a high vacuum state in the furnace, with a vacuum degree of 4x10 -3 Pa, the steel pipe is in an upright state in the furnace, and the steel pipe is Kovar 4J50 alloy steel;

[0056] (2) placing the cathode copper into a graphite crucible for heating and melting to form copper liquid;

[0057] (3) Preheat the steel pipe dried in step (1) to 600°C and keep it warm for 2 hours;

[0058] (4) Refining the copper liquid obtained in step (2), pouring it into the steel pipe preheated in step (3) after refining, then cooling down to 300° C. with the furnace, taking out the furnace and cooling to room temperature to obtain a composite ingot;

[0059] (5) shaping the composite billet into an extruded billet;

[0060] (6) the extruded billet is placed in a 500-ton extruder, and extr...

Embodiment 3

[0064] A copper core kovar alloy composite wire for electronic packaging is prepared according to the following steps:

[0065] (1) Clean and dry the steel pipe, put it into a vacuum melting furnace, and keep a high vacuum state in the furnace, with a vacuum degree of 3×10 -2 Pa, the steel pipe is in an upright state in the furnace, and the steel pipe is Kovar 4J33 alloy steel;

[0066] (2) placing the cathode copper into a graphite crucible for heating and melting to form copper liquid;

[0067] (3) Preheat the steel pipe dried in step (1) to 600°C and keep it warm for 2 hours;

[0068] (4) Refining the copper liquid obtained in step (2), pouring it into the steel pipe preheated in step (3) after refining, then cooling down to 300° C. with the furnace, taking out the furnace and cooling to room temperature to obtain a composite ingot;

[0069] (5) shaping the composite billet into an extruded billet;

[0070] (6) the extruded billet is placed in a 500-ton extruder, and ext...

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Abstract

The invention relates to the technical field of electronic packaging materials, in particular to a copper core-kovar alloy composite wire for electronic packaging. The copper rod and the kovar alloy are compounded by adopting a mechanical combination coating method, the bonding strength between interfaces of the copper rod and the kovar alloy is relatively low, and the air tightness of the obtained composite material needs to be further improved. Based on the problems, the invention provides the copper core -kovar alloy composite wire for electronic packaging, a composite packaging material with a copper core coated with kovar alloy is obtained by adopting a full metallurgical bonding mode, the air tightness of the packaging material is greatly improved, and the conductivity and the anti-electromagnetic interference capability of the packaging material are synchronously improved.

Description

technical field [0001] The invention relates to the technical field of electronic packaging materials, in particular to a copper core Kovar alloy composite wire for electronic packaging. Background technique [0002] With the development of the electronics industry, it is required to provide sealing materials with multiple properties. For some electronic devices, the expansion alloy leads have high electrical conductivity, high thermal conductivity, and good sealing properties with glass and ceramics. requirements, but it is difficult for a single metal or alloy to meet such performance requirements. For example, a single Kovar alloy has good sealing performance with glass and ceramics, but its electrical and thermal conductivity is poor. Although copper has high electrical conductivity and high thermal conductivity, But because of its large expansion coefficient, it does not match with glass and ceramics, and its sealing performance is not good. [0003] Composite material...

Claims

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Application Information

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IPC IPC(8): H01B1/02H01B13/00C22C1/02C22F1/02C22F1/08B21C37/04C21D9/52
CPCH01B1/026B21C37/04C22C1/02C22F1/08C22F1/02C21D9/525H01B13/00
Inventor 蒋红军李增德李箐
Owner 江苏国镍新材料科技有限公司
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