Method for preparing flexible electron and flexible electron

Abstract

The invention provides a method for preparing a flexible electron. The method comprises the following steps: S1, pouring liquid GaIn liquid metal or liquid GaInSn liquid metal into a silicone tube by using a negative pressure method; s2, the silicone tube filled with the liquid metal is stored in a low-temperature environment until the liquid metal is crystallized and solidified; s3, the crystallized and solidified liquid metal is taken out of the silicone tube, and a metal wire is obtained; s4, constructing a circuit pattern by using metal wires to obtain a target circuit; s5, using liquid silica gel to package the target circuit; and S6, after the liquid silica gel is cured, heating is carried out, so that the solid metal wires are molten into liquid, and the flexible electron is obtained. The invention also provides a flexible electronic equipment. The method has the beneficial effects that the manufacturing process for preparing the flexible electronics from the liquid metal can be simplified, the yield is improved, and the cost is reduced.

Description

technical field [0001] The invention relates to flexible electronics, in particular to a method for preparing flexible electronics and flexible electronics. Background technique [0002] Gallium-based liquid metal is currently the only material that has both metal conductivity and fluidity at room temperature. Theoretically, the deformation ability of flexible electronics prepared based on liquid metal is only limited by the elastic packaging material. Therefore, liquid metal has been widely used in flexible electronics. electronics manufacturing. [0003] At present, the methods for preparing flexible electronics based on liquid metal mainly include: (1) Photolithography: Photolithography cannot directly prepare liquid metal flexible electronics, but it can be used to prepare circuit templates by photolithography, combined with subsequent imprinting or selective wetting (2) Microchannel injection method: The microchannel method mainly utilizes the characteristics of low vi...

AI Technical Summary

Problems solved by technology

[0004] Photolithography, additive manufacturing, and subtractive methods cannot build circuits inside elastomers, so the prepared liquid metal flexible electronics do not have the ability of large strain

The flexible electronics prepared by the microchannel injection method can withstand large strain because the liquid metal is encapsulated inside the elastomer. Air is injected into the channel, and at the same time, due to the large surface tension of liquid metal, the right angle of the channel cannot be completely filled, resulting in low yield rate, which limits the promotion of its commercial application