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Bio-based epoxy resin pouring sealant and preparation method thereof

A technology based on epoxy resin and epoxy resin, which is applied in the field of bio-based epoxy resin potting glue and its preparation, can solve the problems of low molecular chain flexibility, large internal stress, and high chemical crosslinking density, so as to broaden the range of raw materials Good source, good flame retardancy and mechanical properties

Active Publication Date: 2022-01-04
JIANGNAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the chemical crosslinking density of the cured structure of pure bisphenol A epoxy resin is high, the flexibility of the molecular chain is low, and the internal stress is large, resulting in greater brittleness of the cured material, poor impact resistance and fatigue resistance, which limit its use in some Application and development of high-tech fields that require high durability and reliability

Method used

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  • Bio-based epoxy resin pouring sealant and preparation method thereof
  • Bio-based epoxy resin pouring sealant and preparation method thereof
  • Bio-based epoxy resin pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A bio-based epoxy resin potting glue, the preparation method of which comprises the following steps:

[0043] (1) Synthesis of multi-arm cardanol-based cyclotriphosphazene epoxy resin (ECC)

[0044] Mix 100 mL of 1,4-dioxane, 54.00 g (0.18 mol) of cardanol and 18.22 g (0.18 mol) of triethylamine, and add 10.43 g (0.03 mol of ) 1,4-dioxane solution of hexachlorocyclotriphosphazene in 300 mL, after dropping, the system was heated to 98°C and stirred and refluxed for 48 hours; after the reaction was completed, cooled to room temperature, suction filtered, and the filtrate was concentrated and dried to obtain Brown-yellow oily liquid, namely multi-arm cardanol-based cyclotriphosphazene resin (CC);

[0045] In a three-necked round-bottomed flask equipped with a precision thermometer and mechanically stirred, 190 g of CC was added, the temperature was stabilized at 50 ° C, and 20 g of formic acid (FA) and 180 g of hydrogen peroxide (50%) were slowly added dropwise at the sam...

Embodiment 2

[0057] A bio-based epoxy resin potting glue, the preparation method of which comprises the following steps:

[0058] (1) Synthesis of multi-arm cardanol-based cyclotriphosphazene epoxy resin (ECC)

[0059] Mix 100 mL of 1,4-dioxane, 45.00 g (0.15 mol) of cardanol and 15.18 g (0.15 mol) of triethylamine, and add 10.43 g (0.03 mol of ) 1,4-dioxane solution of hexachlorocyclotriphosphazene in 300 mL, after dropping, the system was heated to 98°C and stirred and refluxed for 48 hours; after the reaction was completed, cooled to room temperature, suction filtered, and the filtrate was concentrated and dried to obtain Brown-yellow oily liquid, namely multi-arm cardanol-based cyclotriphosphazene resin (CC);

[0060] In a three-necked round-bottomed flask equipped with a precision thermometer and mechanically stirred, 166.5 grams of CC was added, and the temperature was stabilized at 50°C, and 15g of formic acid (FA) and 135g of hydrogen peroxide (50%) were slowly added dropwise at t...

Embodiment 3

[0069] A bio-based epoxy resin potting glue, the preparation method of which comprises the following steps:

[0070] (1) Synthesis of multi-arm cardanol-based cyclotriphosphazene epoxy resin (ECC)

[0071] Mix 100 mL of 1,4-dioxane, 54.00 g (0.18 mol) of cardanol and 18.22 g (0.18 mol) of triethylamine, and add 20.86 g (0.06 mol of ) 1,4-dioxane solution of hexachlorocyclotriphosphazene in 300 mL, after dropping, the system was heated to 98°C and stirred and refluxed for 48 hours; after the reaction was completed, cooled to room temperature, suction filtered, and the filtrate was concentrated and dried to obtain Brown-yellow oily liquid, namely multi-arm cardanol-based cyclotriphosphazene resin (CC);

[0072] In a three-necked round-bottomed flask equipped with a precision thermometer and mechanically stirred, 125 grams of CC was added, the temperature was stabilized at 50 °C, and 10 g of formic acid (FA) and 90 g of hydrogen peroxide (50%) were slowly added dropwise at the s...

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Abstract

The invention discloses a bio-based epoxy resin pouring sealant. The bio-based epoxy resin pouring sealant contains multi-arm cardanol-based cyclotriphosphazene epoxy resin, and the multi-arm cardanol-based cyclotriphosphazene epoxy resin is prepared by reacting phosphonitrilic chloride trimer with cardanol and then performing epoxidation. According to the invention, cardanol and cyclotriphosphazene are organically combined through molecular design, the functionalized cardanol epoxy resin with excellent thermal stability and flame retardance is prepared, the bio-based epoxy pouring sealant with excellent comprehensive performance is prepared, and the bio-based epoxy pouring sealant has important application value.

Description

technical field [0001] The invention relates to the technical field of epoxy resin adhesives, in particular to a bio-based epoxy resin potting adhesive containing a multi-arm cardanol-based cyclotriphosphazene epoxy resin and a preparation method thereof. Background technique [0002] With the rapid development of new energy vehicles and electronics industries, the amount of potting glue is increasing, and epoxy resin potting glue is widely used because of its excellent performance and simple process. The composition of epoxy encapsulant includes epoxy resin, curing agent, epoxy diluent, filler, etc. The research on potting glue is mainly concentrated in some developed countries such as the United States, Japan, and Germany. The products are complete and have good performance. However, my country started late, and most of the potting glue products are at a low-grade level, and high-grade potting glue depends on imports. [0003] Bio-based materials refer to biological mater...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04
CPCC09J163/00C09J11/04C08L2201/02C08K2003/2227C08L63/00C08K3/22
Inventor 刘敬成黄家峰顾志伟
Owner JIANGNAN UNIV
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