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A kind of adhesive, chip bonding film and preparation method thereof

An adhesive and curing agent technology, applied in the direction of adhesives, polyether adhesives, adhesive types, etc., can solve the problems of fracture, chip and DAF delamination, easy to warp, etc., to achieve smooth surface, preparation Simple method and excellent performance

Active Publication Date: 2022-03-11
WUHAN CHOICE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this experiment, the stacked chip and DAF are prone to stress concentration, which will lead to delamination and fracture of the chip and DAF
With the development of miniaturization and high efficiency of semiconductor devices, the thickness of wafers used in semiconductor devices is decreasing day by day, and the number of stacked chips is increasing, which makes stacked chips and DAF more vulnerable to thermal shock experiments. Warpage occurs, and delamination and fracture of chips and DAFs are more likely to occur

Method used

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  • A kind of adhesive, chip bonding film and preparation method thereof
  • A kind of adhesive, chip bonding film and preparation method thereof
  • A kind of adhesive, chip bonding film and preparation method thereof

Examples

Experimental program
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preparation example Construction

[0057] In a third aspect, the present application also provides a method for preparing a die bonding film, including:

[0058] providing the raw materials of the adhesive provided in the first aspect; and

[0059] After the raw materials are mixed, they are flattened and dried to obtain a die-bonding film.

[0060] It should be noted that the "smoothness" here refers to: the mixture after the raw materials are uniformly mixed forms a film layer with a smooth surface. Specifically, the following steps can be adopted:

[0061] The mixture after the raw materials are evenly mixed is coated on the substrate to form a film layer with a flat surface.

[0062] In some embodiments, the method for preparing a die-bonding film includes the following steps:

[0063] raw materials for providing the substrate and the adhesive of the first aspect; and

[0064] After mixing the raw materials of the adhesive, it is coated on the substrate and dried to form a DAF on the substrate.

[0065...

Embodiment 1

[0079] An adhesive, in parts by mass, comprising: 15 parts of bisphenol F epoxy resin, 25 parts of polyurethane modified epoxy resin, 10 parts of naphthalene ring epoxy resin, 20 parts of phenoxy resin, indene oligomer 5 parts, 17.5 parts of silicon dioxide, 4 parts of DICY (dicyandiamide), 0.1 part of 4,5-bis(hydroxymethyl)-2-phenyl-1H-imidazole.

[0080] The die-bonding film was prepared using the raw materials of the adhesive provided in this example, and the specific preparation steps were as follows:

[0081] Provide PET release film,

[0082] Using methyl isobutyl ketone as a solvent, mix the raw materials of the above adhesive with methyl isobutyl ketone evenly to obtain a mixture, and coat the mixture on a PET release film with a coating machine, put it in an oven, and dry it Finally, die-bonding film A was obtained on the PET release film.

Embodiment 2

[0084] An adhesive, in parts by mass, comprising: 15 parts of bisphenol F epoxy resin, 30 parts of polyurethane modified epoxy resin, 15 parts of naphthalene ring epoxy resin, 30 parts of phenoxy resin, indene oligomer 10 parts of the compound, 20 parts of silicon dioxide, 3 parts of DICY (dicyandiamide), 0.2 parts of 4,5-bis(hydroxymethyl)-2-phenyl-1H-imidazole.

[0085] The raw materials of the adhesive provided in this example were used to prepare a die-bonding film, and the specific preparation method was the same as that of the die-bonding film A in Example 1 to obtain a die-bonding film B.

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Abstract

The embodiment of the present application discloses an adhesive, a chip bonding film and a preparation method thereof, which relate to the field of chip packaging technology, and the adhesive includes epoxy resin, phenoxy resin, indene oligomer, filler, and curing agent; In parts by mass, the epoxy resin is 20-60 parts, the phenoxy resin is 20-30 parts, the indene oligomer is 5-10 parts, the filler is 15-30 parts, and the curing agent is 1-5 parts. The application also provides a chip bonding film and a preparation method thereof. The adhesive provided by this application uses epoxy resin, phenoxy resin and indene oligomer as a curable matrix to improve the thermal stress after the adhesive is cured, so that it is not suitable for the preparation of the die bonding film to occur during the temperature change process. Warping, reducing delamination and fracture of semiconductor devices based on the die bonding film during the manufacturing process.

Description

technical field [0001] The present application relates to the technical field of chip packaging, in particular to an adhesive, a chip bonding film and a preparation method thereof. Background technique [0002] With the high functionality of semiconductor packages and high-density mounting inside semiconductor packages, the frequency of use of Die Attach Film (DAF) in semiconductor packages is gradually increasing. As the bonding material between chips and brackets, chips and chips in semiconductor devices, the mechanical strength, bonding strength, heat resistance and thermal conductivity of DAF directly affect the reliability of semiconductor devices. play an important role in bonding materials. [0003] In the manufacturing process of semiconductor devices, in order to evaluate, analyze and improve the environmental adaptability of semiconductor devices, it is often necessary to conduct thermal shock experiments on semiconductor devices. This experiment tests the chemic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00
CPCC09J163/00C09J171/12C09J11/04C09J11/06C09J7/10H01L23/295C08L2201/08C08L63/00C08L71/12C08K5/01C08K3/36C08G59/621C09J171/00C09J2463/00C08L71/00C09J2203/326C08L63/04C09J7/30C09J2301/408C09J2301/312C09J11/08
Inventor 伍得廖述杭李婷王义苏峻兴
Owner WUHAN CHOICE TECH CO LTD