Epitaxial structure and growth method of InGaN quantum dots

An epitaxial structure, quantum dot technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as restricting the development and application of long-wavelength GaN-based optoelectronic devices, unfavorable for the epitaxial growth of high-density and high-In composition InGaN quantum dot materials, etc. , to achieve the effect of inhibiting the escape of In atoms, inhibiting the decomposition of In-N, and reducing the polarization effect

Pending Publication Date: 2022-01-11
NORTHWESTERN POLYTECHNICAL UNIV
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Problems solved by technology

Therefore, the traditional single-layer GaN barrier structure is not conducive to the epitaxial growth of high-density and high-In composition InGaN quantum dot materials, which seriously restricts the development and application of long-wavelength GaN-based optoelectronic devices.

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  • Epitaxial structure and growth method of InGaN quantum dots
  • Epitaxial structure and growth method of InGaN quantum dots

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Embodiment Construction

[0035] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0036] The invention provides an epitaxial structure and a growth method of InGaN quantum dots. Its purpose is to suppress the adverse effects of the high-temperature growth process of the GaN barrier layer on the high-In content InGaN quantum dots by adopting a composite barrier structure, improve the epitaxial crystal quality of the InGaN quantum dots, and help obtain high-In content with high luminous efficiency. InGaN quantum dot materials are expected to fundamentally improve the luminescence performance of GaN-based long-wavelength optoelectronic devices.

[0037] An epitaxial structure of InGaN quantum dots, comprising a substrate 11, a GaN epitaxial template layer 12, an InGaN quantum dot layer 13, a first InGaN capping layer 14, a second InGaN capping layer 15, and a GaN capping layer 16;

[0038] The GaN epitaxial template layer 12 is grown o...

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Abstract

The invention discloses an epitaxial structure of an InGaN quantum dot and a growth method of the InGaN quantum dot. The epitaxial structure comprises a substrate made of sapphire, silicon, silicon carbide, gallium nitride or gallium arsenide; a GaN template layer which grows on the substrate; an InGaN quantum dot layer which grows on the GaN template layer; a first InGaN cover layer which grows on the InGaN quantum dot layer; a second InGaN cover layer which grows on the first InGaN cover layer; and a GaN cap layer which grows on the second InGaN cap layer. The InGaN quantum dot layers, the InGaN cover layer and the GaN cover layer are arranged periodically, and the InGaN quantum dot layers, the InGaN cover layer and the GaN cover layer sequentially and repeatedly grow on the GaN cover layer. By adopting a composite barrier layer structure, the adverse effect of the high-temperature growth process of the GaN barrier layer on the high-In-content InGaN quantum dot is inhibited, so that the long-wavelength luminous efficiency of the InGaN quantum dot material is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an epitaxial structure and a growth method of InGaN quantum dots. Background technique [0002] Compared with the traditional quantum well structure, InGaN quantum dots have a special three-dimensional confined structure, which can not only weaken the quantum confinement Stark effect (QCSE), which is unfavorable for material luminescence, but also has high thermal stability and is insensitive to defects. Etc. Therefore, if InGaN quantum dots are used as the active region material, it will help to improve the luminous efficiency of GaN-based optoelectronic devices. [0003] However, in the actual epitaxial growth process, in order to improve the crystal quality of the material, the growth temperature of the GaN barrier layer wrapping the InGaN quantum dots is required to be above 800°C. However, higher temperature can easily lead to the breakage of In-N bond, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/06H01L33/32
CPCH01L33/0062H01L33/06H01L33/32
Inventor 刘炜张杰张淑媛赵恒岩刘泽宇
Owner NORTHWESTERN POLYTECHNICAL UNIV
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