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Pellicle, exposure original plate with pellicle, method for producing semiconductor device, method for producing liquid crystal display panel, method for recycling exposure original plates, and method for reducing release residue

A technology of protective film and protective film, which is applied in semiconductor/solid-state device manufacturing, photolithography process exposure device, pressure-sensitive film/sheet, etc. It can solve the problems of difficult-to-expose original plate cleaning, etc., to ease cleaning conditions, improve production efficiency, damage reduction effect

Pending Publication Date: 2022-01-11
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] These operations are usually carried out in a clean room, but even in the clean room, it is difficult to keep the exposure master clean all the time

Method used

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  • Pellicle, exposure original plate with pellicle, method for producing semiconductor device, method for producing liquid crystal display panel, method for recycling exposure original plates, and method for reducing release residue
  • Pellicle, exposure original plate with pellicle, method for producing semiconductor device, method for producing liquid crystal display panel, method for recycling exposure original plates, and method for reducing release residue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0139] After precise cleaning of the pellicle frame made of aluminum alloy (outline dimensions: 149mm×115mm×3mm, wall thickness 2mm, flatness on the end surface side coated with adhesive for mask attachment: 15μm), on the end surface on the 15μm side, Apply an acrylic adhesive (product name: SK-Dyne SN-70A) manufactured by Soken Chemical Co., Ltd. over the entire circumferential direction of the end face and at the same width as the pellicle frame. , containing 95% by mass of the monomer component is an acrylic polymer containing an oxirane group-containing (meth)acrylate as a base material, and contains 2 % by mass (solid content) of polyvinyl ether compound), and left to stand at room temperature for 60 minutes. Thereafter, a spacer was placed on an aluminum plate having a flatness of 5 μm, and the pellicle frame coated with the adhesive was placed with the adhesive facing downward. As a result, the adhesive is processed flat in contact with the flat spacer.

[0140] Next,...

Embodiment 2

[0149] An acrylic adhesive manufactured by Soken Chemical Co., Ltd. (product name: SN-25B, 40% by mass of the monomeric component is an (meth)acrylic acid containing an oxirane group was used for the mask attachment adhesive. ester acrylic polymer as the base material), except that, the pellicle film completed in the same procedure as in Example 1 was attached to the same 6025 mask substrate as in Example 1.

[0150] In the same manner as in Example 1, after leaving the mask blank with the pellicle attached at room temperature for 24 hours, 193 nm ArF Laser at 10J / cm 2 UV rays are irradiated.

[0151] After being left at room temperature for 1 hour after ultraviolet irradiation, the pellicle was slowly peeled upward from the mask substrate at a speed of 0.1 mm / sec.

[0152] Visual observation of the mask blank after peeling revealed slightly thin streaks in the contour portion where the pellicle was attached. When the mass of the substrate after peeling was measured and com...

Embodiment 3

[0154] An acrylic adhesive manufactured by Soken Chemical Co., Ltd. (product name: SN-24C, containing 90% by mass of the monomer component is an (meth)acrylic acid containing an oxirane group was used as the adhesive for the mask. ester acrylic polymer as the base material), except that, the pellicle film completed in the same procedure as in Example 1 was attached to the same 6025 mask substrate as in Example 1.

[0155] In the same manner as in Example 1, after leaving the mask blank with the pellicle attached at room temperature for 24 hours, 193 nm ArF Laser at 10J / cm 2 UV rays are irradiated.

[0156] After being left at room temperature for 1 hour after ultraviolet irradiation, the pellicle was slowly peeled upward from the mask substrate at a rate of 0.1 mm / sec.

[0157] Visual observation of the mask blank after peeling revealed slightly thin streaks in the contour portion where the pellicle was attached. The mass of the substrate after peeling was measured, and com...

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Abstract

[Problem] To provide a pellicle, exposure original plate with pellicle, method for recycling exposure original plates and method for reducing peel residue, with which it is possible to reduce the residue which adheres to the exposure original plate when peeling a pellicle from an exposure original plate after use in lithography, particularly after use in ArF lithography. [Solution] A pellicle (10) comprising a pellicle film (12), a pellicle frame (11) which is provided with the pellicle film (12) at one end surface thereof, an adhesive layer (14) which is provided to the other end surface of the pellicle frame (11), wherein after affixing the adhesive layer (14) of the pellicle (10) to a quartz mask substrate (1), the part of the pellicle (10) to which the adhesive layer (14) is adhered is irradiated with 10 J / cm2 of 193 nm UV light from the rear of the substrate (1), and when the pellicle (10) has been peeled after being irradiated, the amount of peeling residue of the adhesive layer (14) that remains on the substrate (1) does not exceed 0.5 mg.

Description

technical field [0001] The present invention relates to a pellicle, an exposure master with a pellicle, a method for manufacturing a semiconductor device, a method for manufacturing a liquid crystal display panel, a method for regenerating an exposure master, and a method for reducing peeling residue. Background technique [0002] In the manufacture of large-scale integrated circuits (Large Scale Integrated circuit, LSI), super LSI and other semiconductor devices, or liquid crystal display panels, etc., light is irradiated on semiconductor wafers or liquid crystal original plates to make patterns, but if dust adheres to the surface used at this time If the original plate is exposed, the dust will absorb light or bend light. Therefore, in addition to the deformation of the transferred pattern or rough edges, the substrate will also be stained black, and there will be impacts on size, quality, and appearance. damage problem. In addition, in this invention, "exposure original ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/62G03F7/20
CPCG03F1/62G03F1/64C08F220/281C09J133/14C08F220/1804C08F220/06C08F220/20C08F220/1808C09J7/38H01L21/683G03F7/20C09J133/00C09J129/10C09J11/08G03F1/66G03F7/70983G03F1/26H01L21/0274
Inventor 滨田裕一西村晃范
Owner SHIN ETSU CHEM IND CO LTD