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Diffusion oxidation annealing furnace thermostatic bath control circuit improvement process

A technology of control circuit and diffusion oxidation, applied in furnace control device, furnace, furnace cooling and other directions, can solve problems such as affecting the service life of thermostatic bath, disconnection of air switch, and overheating of devices, so as to improve the yield of production line and ensure The effect of normal operation and improved cooling effect

Pending Publication Date: 2022-01-25
天合光能(宿迁)光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides an improvement process for the control circuit of the constant temperature tank of the diffusion oxidation annealing furnace. One of the purposes is to have the function of controlling a single tube corresponding to a single air switch. The problem that all the root canal constant temperature baths stop working; another purpose is to solve the problem that the overheating of the components inside the constant temperature bath will affect the service life of the constant temperature bath, so as to achieve the effect of efficient heat dissipation on the constant temperature bath

Method used

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  • Diffusion oxidation annealing furnace thermostatic bath control circuit improvement process
  • Diffusion oxidation annealing furnace thermostatic bath control circuit improvement process
  • Diffusion oxidation annealing furnace thermostatic bath control circuit improvement process

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Embodiment 1

[0035] like Figure 1-7As shown, the present invention provides a process for improving the control circuit of the constant temperature tank of a diffusion oxidation annealing furnace, including a main engine base 1, a constant temperature tank heat dissipation mechanism 2 is arranged on the top of the main engine base 1, and a control The circuit improvement mechanism 3 and the top of the control circuit improvement mechanism 3 are provided with a fire prevention mechanism 4, and the constant temperature tank heat dissipation mechanism 2 includes a T-shaped support platform 21, which is fixedly installed on the top of the host base 1, and the T-shaped support platform 21 A dehumidification box 22 is fixedly installed at the bottom of the inner cavity, and a heat dissipation fan 23 is fixedly connected to the right side of the dehumidification box 22. The air inlet pipe of the heat dissipation fan 23 extends to the right side of the T-shaped support platform 21. The control cir...

Embodiment 2

[0037] like Figure 1-7 As shown, on the basis of Embodiment 1, the present invention provides a technical solution: preferably, the left side of the dehumidification box body 22 is detachably connected with a detachable connecting pipe 24, and the left side of the dehumidifying connecting pipe 24 is threadedly connected with a connection Flexible hose 25, the inner cavity of the detachable connecting pipe 24 is filled with activated carbon, the top of the inner cavity of the T-shaped support platform 21 is fixedly installed with a shunt pipe 26, and the end of the connecting hose 25 away from the detachable connecting pipe 24 is connected to the bottom of the shunt pipe 26 Threaded connection, the back of the branch box 31 is provided with an air outlet 28, both sides of the inner cavity of the branch box 31 are fixed with guide plates 27, the top of the branch pipe 26 and the bottom of the branch box 31 are fixed by plastic air ducts Connection, the cooling square tube 221 i...

Embodiment 3

[0039] like Figure 1-7 As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the bottom of the inner cavity of the cooling square tube 221 is fixedly installed with a rock wool blocking square tube 2211, and the front and back of the rock wool blocking square tube 2211 Both of them are fixedly installed with a semiconductor refrigerating sheet 2212, the cold end of the semiconductor refrigerating sheet 2212 is set on the outer wall of the rock wool blocking square tube 2211, and the hot end of the semiconductor refrigerating sheet 2212 is set in the inner cavity of the rock wool blocking square tube 2211, the semiconductor cooling sheet 2212 The hot end of the sheet 2212 is fixedly equipped with cooling fins, the bottom of the inner cavity of the cooling square tube 221 is fixedly equipped with a hollow support tube 2214, the top of the hollow support tube 2214 is fixedly connected with a hot end heat dissipation pipe 2213, and t...

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Abstract

The invention discloses a diffusion oxidation annealing furnace thermostatic bath control circuit improvement process, and relates to the technical field of diffusion oxidation annealing furnace main machine tables. The diffusion oxidation annealing furnace thermostatic bath control circuit improvement process comprises a main machine base, a thermostatic bath heat dissipation mechanism is arranged at the top of the main machine base, and a control circuit improvement mechanism is arranged at the top of the thermostatic bath heat dissipation mechanism. A fireproof mechanism is arranged at the top of the control circuit improvement mechanism, the thermostatic bath heat dissipation mechanism comprises a T-shaped supporting table, and the T-shaped supporting table is fixedly installed at the top of the main machine base. According to the process, five thermostatic bath bodies share one air switch instead of being controlled by a single pipe corresponding to a single air switch, so that the thermostatic bath bodies of other pipelines operate normally when the single pipe fails, the failure of the single-pipe thermostatic bath body does not affect the work of other thermostatic bath bodies after improvement, the number of silicon wafer isolation rework of a production line is reduced, the production line yield is synchronously improved, the downtime risk of a whole machine table is reduced, and the production safety is improved.

Description

technical field [0001] The invention relates to a control circuit improvement process, relates to the technical field of the main platform of a diffusion oxidation annealing furnace, and in particular to a control circuit improvement process of a constant temperature tank of a diffusion oxidation annealing furnace. Background technique [0002] The production of silicon wafers needs to be processed by a diffusion oxidation annealing furnace. During the working process of the diffusion oxidation annealing furnace, the furnace body is controlled by the host platform. device. There are following problems at prior art: [0003] 1. The constant temperature tanks inside the main frame of the existing diffusion oxidation annealing furnace are all connected in parallel to an air switch. When the main frame is in normal operation, the single tube constant temperature tank failure will cause the open switch to be disconnected, resulting in the remaining four tube constant temperature...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F27B17/00F27D9/00F27D19/00F27D21/04F25B21/02A62C31/02H01L21/67
CPCF27B17/00F27D9/00F27D19/00F27D21/04F25B21/02A62C31/02H01L21/67248H01L21/67253H01L21/67276F27D2009/0005F27D2019/0056Y02P10/122
Inventor 张成家李多伟
Owner 天合光能(宿迁)光电有限公司
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