Preparation process of A2-level nano inorganic heat preservation board

A preparation process and nano-inorganic technology, which is applied in the field of thermal insulation board preparation technology, can solve problems such as low thermal conductivity, and achieve the effects of small thermal conductivity and strong hydrophobicity.

Active Publication Date: 2022-02-15
WANHUA MODULAR PROJECTS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]The purpose of the present invention is to solve the deficiencies of traditional organic thermal insulation board and traditional inorganic thermal insulation board technology, and to provide a non-combustible, low thermal conductivity, Preparation process of highly hydrophobic A2 grade nano-inorganic insulation board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A preparation process of an A2 grade nano-inorganic insulation board in this embodiment is used to prepare a melamine resin modified board, which specifically includes the following steps:

[0027] (1) Put 100 parts of water, 1 part of dispersant bentonite, 1 part of attapulgite, and 10 parts of airgel into the container of the high-speed disperser in sequence, and then stir at a speed of 3000r / min at normal temperature and pressure for 5 Minutes to obtain a uniformly mixed airgel slurry;

[0028] (2) Add 20 parts of melamine resin, 0.4 parts of formic acid and 40 parts of hollow glass microspheres to the airgel slurry obtained in step (1), and then stir at 5000r / min for 10 minutes at normal temperature and pressure to obtain a mixed Uniform melamine resin modified airgel slurry;

[0029] (3) The melamine resin modified airgel slurry obtained in step (2) was injected into the mold, smoothed and pressed, then placed in an oven for heating and curing at 150°C for 60 minu...

Embodiment 2

[0032] A preparation process of an A2-grade nano-inorganic insulation board in this embodiment is used to prepare a melamine resin modified airgel insulation board, which specifically includes the following steps:

[0033] (1) Add 200 parts of water, 3 parts of dispersant silane coupling agent KH602, 1.5 parts of bentonite, 1.5 parts of attapulgite, and 20 parts of airgel into the container of the high-speed disperser in sequence, and then put them under normal temperature and pressure Stir at a speed of 5000r / min for 5 minutes to obtain a uniformly mixed airgel slurry;

[0034] (2) Add 35 parts of melamine resin, 0.7 parts of formic acid and 80 parts of hollow glass microspheres to the airgel slurry obtained in step (1), and then stir at 5000 r / min for 10 minutes at normal temperature and pressure to obtain a mixed Uniform melamine resin modified airgel slurry;

[0035] (3) The melamine resin modified airgel slurry obtained in step (2) was injected into the mold, smoothed an...

Embodiment 3

[0038]A preparation process of an A2-grade nano-inorganic insulation board in this embodiment is used to prepare a melamine resin modified airgel insulation board, which specifically includes the following steps:

[0039] (1) Add 100 parts of water, 1 part of dispersant dibutyl phthalate, 1 part of bentonite, 1 part of diatomaceous earth, and 10 parts of airgel into the container of the high-speed disperser in sequence, and then Press down and stir at a speed of 5000r / min for 5 minutes to obtain a uniformly mixed airgel slurry;

[0040] (2) Add 40 parts of melamine resin, 0.8 parts of formic acid and 60 parts of hollow glass microspheres to the airgel slurry obtained in step (1), and then stir at 5000 r / min for 10 minutes at normal temperature and pressure to obtain a mixed Uniform melamine resin modified airgel slurry;

[0041] (3) The melamine resin modified airgel slurry obtained in step (2) was injected into the mold, smoothed and pressed, then placed in an oven for heati...

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Abstract

The invention relates to a preparation process of an A2-level nano inorganic heat preservation board, wherein the preparation process comprises the following steps: 1) sequentially adding water, a dispersing agent, a stabilizer and aerogel into a container of a high-speed dispersion machine, and stirring for 5-30 minutes to obtain uniformly mixed aerogel slurry; 2) adding an organic resin cementing material, a curing agent and an inorganic filler into the aerogel slurry obtained in the step (1), and then stirring for 5-30 minutes at the speed of 500-5000 r / min at normal temperature and normal pressure to obtain uniformly mixed organic resin modified aerogel slurry; and 3), injecting the organic resin modified aerogel slurry obtained in the step 2 into a mold, troweling and pressing, then putting the organic resin modified aerogel slurry into a drying oven, heating and curing, and thus preparing the organic resin modified aerogel heat preservation plate. The A2-level nano inorganic heat preservation plate prepared through the preparation technology of the A2-level nano inorganic heat preservation plate is good in flame retardant property, low in heat conductivity and high in hydrophobicity.

Description

technical field [0001] The invention relates to a preparation process of an A2-level nano-inorganic heat preservation board, and belongs to the technical field of heat preservation board preparation technology. Background technique [0002] Silica airgel has extremely low density, strong hydrophobicity and high transmittance. It is the solid material with the smallest thermal conductivity so far. It is currently mainly used in the industrial field, and there are only a few experimental applications in the civil construction field. In recent years, with the vigorous promotion of fire prevention, energy saving and carbon neutrality, silica airgel materials have attracted more and more attention from the government, academia, business and investment circles. Although silica airgel has so many advantages, its disadvantages of low strength and poor toughness are also prominent. Therefore, there are no insulation materials made solely of silica airgel on the market, but mostly mad...

Claims

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Application Information

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IPC IPC(8): C04B26/12C04B40/02C04B111/27C04B111/28C04B111/40
CPCC04B26/125C04B2111/40C04B2201/20C04B2201/50C04B2201/32C04B2111/27C04B2111/28C04B14/104C04B14/102C04B14/064C04B24/04C04B14/22C04B40/0263C04B24/42C04B14/08C04B24/045Y02B80/10Y02A30/24
Inventor 许亚军王希安赵锟刘访艺徐祥东王耀西高迎弟
Owner WANHUA MODULAR PROJECTS
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