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Laser welding method and system for dissimilar metal film

A technology of laser welding and metal thin film, which is applied in the direction of laser welding equipment, welding equipment, welding equipment, etc., can solve problems such as difficult application, lack of strength, and poor forming, so as to improve the effect of welding process, reduce the bending caused by heat, Avoid the effect of false welding or over welding

Pending Publication Date: 2022-02-18
WUHAN DR LASER TECH CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. Traditionally, the method of hanging tin and melting tin is commonly used to weld copper and aluminum. This method is not well formed and has no good strength. Because the melting point of tin is low and it cannot be welded to workpieces under high temperature, this process is only suitable Used on small workpieces under low temperature conditions (only suitable for welding multi-strand copper wires and small-sized aluminum enameled wires), it is difficult to apply to the production of other products
[0004] 2. Weld copper and aluminum with fusion welding, friction welding, cold pressure welding, explosive welding, electron beam welding, ultrasonic welding and other welding methods. The welded joints are brittle and prone to cracks and pores in the welds. It is inevitable that there will be a fracture. After the fracture occurs, the conductor may be disconnected and the pipeline may leak, so the effect required in actual production is often not achieved.

Method used

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  • Laser welding method and system for dissimilar metal film
  • Laser welding method and system for dissimilar metal film
  • Laser welding method and system for dissimilar metal film

Examples

Experimental program
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Effect test

Embodiment 1

[0048] On the aluminum film 2, a plurality of circular solder joints arranged at intervals are formed with the copper film. Wherein, the thicknesses of the copper film and the aluminum film 2 are 20 μm and 80 μm respectively. The aluminum film has a length of 250 mm and a width of 200 mm, on which a plurality of copper solder joints 1 with a diameter of 4 mm arranged in an array need to be formed.

[0049] The steps are:

[0050] S1. Set the laser welding route according to the welding shape and area of ​​the copper film and the aluminum film.

[0051] The welding route of a solder joint is a spiral welding route from inside to outside or from outside to inside, such as figure 2 As shown, the minimum diameter is between 0.5-1.5mm, the maximum diameter is 4mm, and the distance between adjacent helixes is 0.1-0.5mm.

[0052] After a solder spot is welded, jump to other solder spots for welding, such as image 3 As shown, in this embodiment, jump to adjacent welding spots fo...

Embodiment 2

[0063] The principle, method and structure of this embodiment are basically the same as those of Embodiment 1, the difference is that, as Figure 4 with Figure 5 As shown, the copper solder joint 1 is a square solder joint with a side length of 4 mm. The welding path of a single spot, as a square helix.

Embodiment 3

[0065] The principle, method and structure of this embodiment are basically the same as those of Embodiment 1, the difference is that, as Image 6 As shown, the entire copper film is soldered on the aluminum film. Its solder joints are set as circular solder joints set in an array. The solder joint size is 4mm, the distance between adjacent solder joints is 27mm, and the distance from the edge of the outermost solder joint to the edge of the copper film is 13.875mm.

[0066] S4 When cutting the excess copper film, it can be cut according to the outer edge of the aluminum film. Effect picture as Figure 7 shown.

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Abstract

The invention provides a laser welding method and system for a dissimilar metal film, and the method comprises the steps: setting a welding shape and area according to a welding demand, and determining a laser welding route; vertically stacking metal films to be welded, wherein the metal film with the high melting point is located on the upper part, and the metal film with the low melting point is located on the lower part; the thickness of the metal film with the high melting point is less than or equal to 100 microns; setting laser parameters so that laser irradiates the metal film with the high melting point according to a welding route and scans the metal film; laser with short pulse width and high frequency is adopted, meanwhile, the obtained laser peak energy enables the metal film with the high melting point to be instantly heated and melted without being broken down, laser waste heat is conducted downwards to enable the metal film with the low melting point to be melted, the melted parts of the two metal films form a molten pool, and thus welding is completed. The heating bending of the upper-layer metal film can be effectively reduced, and finally the welding of the dissimilar metal film is realized.

Description

technical field [0001] The invention belongs to the technical field of metal thin film laser welding, and in particular relates to a laser welding method and system for dissimilar metal thin films. Background technique [0002] In the industrial field, both aluminum and copper are good conductive materials. Since aluminum has a lower density than copper (the density of aluminum is only 1 / 3 of copper), it is cheap and rich in resources, so it can be used instead of copper in many cases, which can not only reduce costs and product quality, but also make reasonable use of it. resource. However, the resistivity of aluminum is 60% greater than that of copper, so the conductivity of aluminum is worse than that of copper, and its strength is lower. Therefore, substituting aluminum for copper has certain disadvantages. In order to make full use of the excellent properties of copper and aluminum, it is usually necessary to connect copper and aluminum together to form a composite st...

Claims

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Application Information

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IPC IPC(8): B23K26/323B23K26/70B23K37/04
CPCB23K26/323B23K26/702B23K37/0408B23K2103/10B23K2103/12
Inventor 陈登朱凡梁乔春朱胜鹏
Owner WUHAN DR LASER TECH CORP LTD
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