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Photosensitive resin composition and printed wiring board coated with same

A technology of photosensitive resin and composition, applied in printed circuits, printed circuit parts, circuit substrate materials, etc., can solve the problems of decreased thermal shock resistance of insulating protective films, decreased thermal resistance of solders, etc. properties, obtaining thermal shock resistance, and improving dispersibility

Pending Publication Date: 2022-02-18
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when an organic filler such as an elastomer is blended into the resin composition, the solder heat resistance required for the insulating protective film of the circuit board may decrease.
In addition, inorganic fillers such as barium sulfate are added to prevent a decrease in solder heat resistance. However, if inorganic fillers such as barium sulfate are added, the thermal shock resistance of the insulating protective film may decrease.

Method used

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  • Photosensitive resin composition and printed wiring board coated with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9、 comparative example 1～2

[0108] The components shown in the following Table 1 were blended according to the compounding ratio shown in the following Table 1, and mixed and dispersed at room temperature with a triple roll to prepare the photosensitive materials used in Examples 1-9 and Comparative Examples 1-2. resin composition. And the prepared photosensitive resin composition was applied as follows, and the test sample was produced. Unless otherwise stated, the numbers of the compounding quantity in following Table 1 represent a mass part. In addition, blank columns in Table 1 below indicate that the substance was not blended.

[0109] In addition, the detail of each component in following Table 1 is as follows.

[0110] (A) Photosensitive resin

[0111]●RIPOXY SP-4621: Polyacid-modified epoxy acrylate, which is obtained by reacting acrylic acid with at least a part of the epoxy group of cresol novolak type epoxy resin, and making polyacid and the generated epoxy acrylate The chemical structure ...

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Abstract

The invention provides a photosensitive resin composition and a printed wiring board coated with the photosensitive resin composition. The photosensitive resin composition and the printed wiring board coated with the photosensitive resin composition are capable of forming a photocured product with excellent solder heat resistance and thermal shock resistance and with the basic characteristics such as alkali developability and coating appearance not being damaged. The photosensitive resin composition contains (A) a photosensitive resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a reactive diluent, (E) an epoxy compound, and (F) silica, wherein the (F) silica is (F1) scaly silica having a main surface and an end surface and / or (F2) spherical silica.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, particularly a photosensitive resin composition usable as an insulating coating for a circuit board such as a printed wiring board, and a printed wiring board having a coating obtained by photocuring the photosensitive resin composition. Background technique [0002] A printed wiring board on which a conductive circuit pattern is formed on a substrate such as a rigid substrate or a flexible substrate is used to mount electronic components on pads of the conductive circuit pattern, and the circuit portion other than the pads is covered with a solder resist film as an insulating protective film. This prevents solder from adhering to unnecessary parts when soldering electronic components to circuit boards such as printed wiring boards, and prevents conductive circuits from being oxidized and corroded by humidity due to direct exposure to air. [0003] In addition, with respect to circuit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K1/03
CPCG03F7/004G03F7/027H05K1/0373
Inventor 津留纮树藤井俊树
Owner TAMURA KK
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