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Positive photosensitive resin composition, positive photosensitive dry film, method for producing same, and method for forming pattern

A technology of photosensitive resin and photosensitive resin layer, which is applied in the field of electronic parts, can solve the problems of miniaturization and insufficient study of pattern shape, and achieve the effects of good adhesion, excellent reliability, and excellent drug resistance

Pending Publication Date: 2022-02-18
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent Document 5 proposes a positive-type photosensitive resin composition obtained by adding a cross-linkable acrylic resin to an alkali-soluble resin having a phenolic hydroxyl group, but studies on miniaturization and pattern shape are insufficient, and there is room for improvement in photosensitive properties
[0011] In Patent Document 6 and Patent Document 7, a positive-type photosensitive resin composition formed of a polymer selected from polyimide, polybenzoxazole, and their precursors and an acrylic resin is proposed, which is a cured film Material with excellent physical properties and stress, but there is no description about photolithography performance

Method used

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  • Positive photosensitive resin composition, positive photosensitive dry film, method for producing same, and method for forming pattern
  • Positive photosensitive resin composition, positive photosensitive dry film, method for producing same, and method for forming pattern
  • Positive photosensitive resin composition, positive photosensitive dry film, method for producing same, and method for forming pattern

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Embodiment

[0429] Hereinafter, the present invention will be specifically described with reference to synthesis examples, examples, and comparative examples, but the present invention is not limited to the following examples. In addition, weight average molecular weight (Mw) shows the polystyrene conversion weight average molecular weight obtained by GPC.

[0430] I. Synthesis of Alkali-Soluble Resin (A)

[0431] The chemical structural formulas and names of the compounds used in the following synthesis examples are shown below.

[0432] [chem 64]

[0433]

Synthetic example 1

[0434] [Synthesis example 1] Synthesis of polyimide resin (A1)

[0435] In a 1L flask equipped with a stirrer and a thermometer, add 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP) 30g (81.9mmol), 4-aminophenol (PAP) 0.9g (8.6 mmol), N-methyl-2-pyrrolidone 125g, stirred and dissolved at room temperature. Then, at room temperature, 26.7 g (86.2 mmol) of 3,3',4,4'-oxydiphthalic dianhydride (s-ODPA) dissolved in 270 g of N-methyl-2-pyrrolidone was added dropwise The resulting solution was stirred at room temperature for 3 hours after the dropwise addition. Thereafter, 40 g of xylene was added to the reaction liquid, and heating and reflux was performed for 3 hours while removing generated water to the outside of the system at 170°C. After cooling to room temperature, the reaction solution was added dropwise into 2 L of ultrapure water with stirring, and the precipitate was separated and filtered, washed with water, and dried under reduced pressure at 40°C for 48 hours,...

Synthetic example 2

[0436] [Synthesis example 2] Synthesis of polyimide resin (A2)

[0437] Replace 30 g (81.9 mmol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (6FAP) in Synthesis Example 1 with 2,2-bis(3-amino-4-hydroxyphenyl) ) propane (BAP) 21.2g (81.9mmol), and the polyimide resin (A2) was obtained by the same prescription. When the molecular weight of the polymer was measured by GPC, the weight average molecular weight was 34,000 in terms of polystyrene.

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Abstract

The invention relates to a positive photosensitive resin composition, a positive photosensitive dry film and a manufacturing method thereof, and a pattern forming method. The purpose of the present invention is to provide: a positive photosensitive resin composition which is capable of forming a fine pattern, is capable of obtaining high resolution, has good mechanical characteristics even when cured at low temperature, and is free from deterioration in adhesion force before and after a high-temperature and high-humidity test; and a positive photosensitive dry film. A positive photosensitive resin composition containing: (A) an alkali-soluble resin containing at least one structure selected from the group consisting of a polyimide structure, a polybenzoxazole structure, a polyamideimide structure, and precursor structures thereof; (B) a crosslinkable polymer compound containing a structural unit represented by general formula (1) and having a group that crosslinks with component (A); and (C) a photosensitizer which generates an acid due to light and has an increased dissolution rate in an aqueous alkali solution, and which is a compound having a quinone diazide structure.

Description

technical field [0001] The present invention relates to a positive-type photosensitive resin composition, a positive-type photosensitive dry film, a method for producing the positive-type photosensitive dry film, and an available base using the positive-type photosensitive resin composition and the positive-type photosensitive dry film A method of forming a pattern by developing an aqueous solution, a method of forming a cured film, an interlayer insulating film, a surface protection film, and electronic parts. Background technique [0002] With the miniaturization and high performance of various electronic devices such as personal computers, digital cameras, and mobile phones, the demand for further miniaturization, thinning, and high-density semiconductor devices is also rapidly increasing. Along with this, interlayer insulating films and surface protective films of semiconductor elements are required to have more excellent electrical properties, heat resistance, mechanica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039G03F7/00G03F7/09G03F7/11
CPCG03F7/039G03F7/00G03F7/09G03F7/11G03F7/0233G03F7/0226G03F7/40G03F7/0392C08K5/0025G03F7/161G03F7/162G03F7/168G03F7/2004G03F7/30G03F1/48G03F7/0045G03F7/0397G03F7/075G03F7/322
Inventor 饭尾匡史浦野宏之渡边修竹村胜也
Owner SHIN ETSU CHEM CO LTD
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