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LED packaging process and deep ultraviolet LED

A technology of LED packaging and deep ultraviolet, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems of low production efficiency, time spent on glue, and time-consuming mass production of deep ultraviolet LEDs, etc. Problems, to achieve the effect of improving efficiency, little impact on light emission, and good light transmittance

Pending Publication Date: 2022-02-18
广西东科视创光电科技有限公司
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Problems solved by technology

[0003] One of the purposes of the present invention is to provide a LED packaging process to solve the problems in the prior art that the batch production of deep ultraviolet LEDs takes a long time and the production efficiency is low due to the fact that it takes a certain amount of time to dry the glue. technical problem

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  • LED packaging process and deep ultraviolet LED
  • LED packaging process and deep ultraviolet LED

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specific Embodiment approach

[0043]Further, see figure 1 , as a specific implementation of an LED packaging process provided by the present invention, the material of the silicon dioxide coating film includes one or more of glassy SiO2 and crystalline α-SiO2.

[0044] Crystalline α-SiO2 is only prepared by heat treatment at a lower temperature, so it is directly used as an optical coating material at a low cost. Glassy SiO2 is a common optical coating material. The silicon dioxide coating formed by glassy SiO2 and crystalline α-SiO2 has the characteristics of high strength, good wear resistance, good heat dissipation and good corrosion resistance.

[0045] Further, see figure 1 , as a specific implementation of an LED packaging process provided by the present invention, step S1-1 is set as:

[0046] Bonding the deep-ultraviolet LED chip and the supporting chip on the packaging bracket, and fixing the packaging bracket with the deep-ultraviolet LED chip and the supporting chip on the fixture of the PVD ...

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Abstract

The invention provides an LED packaging process, which comprises the following steps that die bonding is performed on a deep ultraviolet LED chip on a packaging bracket, and the packaging bracket on which the deep ultraviolet LED chip is die-bonded is fixed on a jig of a PVD (Physical Vapor Deposition) coating machine; and the surface of the packaging support and the surface of the deep ultraviolet LED chip are coated with silicon dioxide coating films through the PVD coating machine. The invention further provides a deep ultraviolet LED which comprises the deep ultraviolet LED chip, the packaging support and the silicon dioxide coating films. The deep ultraviolet LED chip is arranged on the packaging support in a die bonding mode. And the silicon dioxide coating films are arranged on the surface of the packaging bracket and the surface of the deep ultraviolet LED chip, so that the packaging efficiency of the deep ultraviolet LED chip is improved.

Description

technical field [0001] The invention belongs to the technical field of LED encapsulation, and more specifically relates to an LED encapsulation process and a deep ultraviolet LED. Background technique [0002] Nowadays, the market demand for deep ultraviolet LEDs is increasing, and deep ultraviolet LEDs are moving toward mass production. At the same time, the production requirements for deep ultraviolet LEDs are also getting higher and higher. Currently common deep ultraviolet LEDs include packaging brackets, quartz cover plates and deep ultraviolet LED chips. When packaging deep ultraviolet LEDs, first install the deep ultraviolet LED chip on the packaging bracket, then apply glue on the packaging bracket, and then fix the quartz cover on the packaging bracket through glue, so that the deep ultraviolet LED chip is located between the quartz cover and the packaging bracket. Between the packaging brackets, it plays the role of protecting the deep ultraviolet LED chip. Since...

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Application Information

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IPC IPC(8): H01L33/00H01L33/44C23C14/10
CPCH01L33/005H01L33/44C23C14/10H01L2933/0025
Inventor 邱德恒徐泓
Owner 广西东科视创光电科技有限公司
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