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Cyanide-free gold plating solution and gold electrocasting made by cyanide-free electroplating process

A cyanide-free gold plating and gold technology, applied in the direction of electroforming, electrolysis, etc., can solve the problems of pure gold such as low hardness, low strength, and easy deformation

Pending Publication Date: 2022-03-01
周大福珠宝文化产业园(武汉)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the common pure gold has low hardness and strength (the Vickers hardness is about 20-40Hv), and it is easy to deform
This physical property limits the shape, configuration, plasticity, and volume of pure gold products, especially hollow full gold products to a certain extent.

Method used

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  • Cyanide-free gold plating solution and gold electrocasting made by cyanide-free electroplating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044]Add the following preparation components of Example 1 to the base solution to form the gold plating solution: anhydrous sodium sulfite, aminotrimethylene phosphoric acid, hydroxyethylidene diphosphoric acid, inorganic phosphate buffer, butylenediamine, sodium hydroxide, antimony tartrate Potassium, triethylenetetramine, saccharin.

[0045] A specific component example of embodiment 1 is: 90g anhydrous sodium sulfite, 100g aminotrimethylene phosphoric acid, 60g hydroxyethylidene diphosphoric acid, 104g inorganic phosphate buffer, 30g butylenediamine, 45g sodium hydroxide, 0.015g tartaric acid Potassium antimony, 1g triethylenetetramine, 0.5g saccharin.

[0046] The process condition of this embodiment 1 is set as: electroplating temperature is 25 ℃, and electroplating current value is 0.2ASD (ampere per square decimeter), and electroplating time is 18h (hour), uses 3% dilute sulfuric acid to adjust pH when electroplating is carried out The value is maintained at the leve...

Embodiment 2

[0049] The formulated medicament of Example 2 includes sodium sulfite, aminotrimethylene phosphoric acid, hydroxyethylidene diphosphoric acid, inorganic phosphate buffer, ethylenediamine, glycine, triethylenetetramine, potassium hydroxide, and saccharin.

[0050] A specific component example of embodiment 2 is: 140g sodium sulfite, 180g aminotrimethylene phosphoric acid, 100g hydroxyethylidene diphosphoric acid, 104g inorganic phosphate buffer, 27g ethylenediamine, 27g glycine, 0.5g triethylenetetramine, 125g potassium hydroxide, 0.3g saccharin.

[0051] The process condition of this embodiment 2 is set as: the electroplating temperature is 25 ℃, the electroplating current value is 0.25ASD (ampere per square decimeter), the electroplating time is 18h (hour), use 3% dilute sulfuric acid to adjust pH when electroplating is carried out The value is maintained at the level of 8.2.

[0052] The thickness of the electroformed gold product made by the process of Example 2 is 220 μm,...

Embodiment 3

[0054] The formulated medicament of Example 3 includes sodium sulfite, aminotrimethylene phosphoric acid, hydroxyethylidene diphosphoric acid, inorganic phosphate buffer, ethylenediamine, glycine, triethylenetetramine, sodium hydroxide, saccharin, potassium antimony tartrate.

[0055] A specific component example of embodiment 3 is: 140g sodium sulfite, 90g aminotrimethylene phosphoric acid, 150g hydroxyethylidene diphosphoric acid, 104g inorganic phosphate buffer, 35g ethylenediamine, 50g glycine, 0.5g triethylenetetramine, 200g sodium hydroxide, 0.3g saccharin, 0.025g antimony potassium tartrate.

[0056] The process condition of this embodiment 3 is set as: the electroplating temperature is 45 ℃, the electroplating current value is 0.3ASD (ampere per square decimeter), the electroplating time is 18h (hour), use 3% dilute sulfuric acid to adjust pH when electroplating is carried out The value is maintained at the level of 7.5.

[0057] The thickness of the electroformed gol...

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Abstract

The cyanide-free gold plating solution comprises gold salt, a complexing agent and organic polybasic acid with multiple hydroxyl groups. The components of the cyanide-free gold plating solution have a synergistic effect, and the cyanide-free gold plating solution is superior to an existing cyanide-free gold plating solution. The working temperature of the cyanide-free gold plating solution ranges from 30 DEG C to 70 DEG C, the pH value ranges from 7.2 to 8.7, and the current density ranges from 0.05 ASD to 0.55 ASD. In the preparation process of the electroplating liquid, explosive thionic acid gold cannot be generated, and the electroplating liquid is environmentally friendly and safe.

Description

technical field [0001] The invention relates to a cyanide-free gold plating solution, a cyanide-free gold plating process and a gold electroforming piece made by the cyanide-free electroplating process. Background technique [0002] Gold is a precious metal with high value preservation and high ornamental value. Objects made of gold, especially those made of pure gold, such as ornaments and other decorations, are very popular among the public. For those skilled in the art who are familiar with the production of gold objects, pure gold means that the gold content is equal to or higher than 99.5%. Consumers also occasionally refer to pure gold as pure gold. However, the common pure gold has low hardness and strength (the Vickers hardness is about 20-40Hv), and it is easy to deform. This physical property limits the shape, configuration, plasticity, and volume of solid gold products, especially hollow full gold products to a certain extent. [0003] Cyanide-free electroplat...

Claims

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Application Information

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IPC IPC(8): C25D3/48C25D1/00
CPCC25D3/48C25D1/00
Inventor 林倩倩周庆华李竹
Owner 周大福珠宝文化产业园(武汉)有限公司
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