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Self-repairing microcapsule, self-repairing electromagnetic shielding repairing putty and preparation method

A self-healing microcapsule, electromagnetic shielding technology, applied in the directions of microcapsule preparation, microsphere preparation, conductive coating, etc., can solve the problems of easy sedimentation of conductive fillers, high density of self-healing shielding putty, etc., and achieves short and good storage time. The effect of electrical conductivity and low density

Pending Publication Date: 2022-03-18
LUOYANG INST OF CUTTING EDGE TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to provide a self-repairing microcapsule, a self-repairing electromagnetic shielding repair putty and a preparation method to solve the technical problems in the prior art that the self-repairing shielding putty has a high density and the conductive filler is easy to settle

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  • Self-repairing microcapsule, self-repairing electromagnetic shielding repairing putty and preparation method
  • Self-repairing microcapsule, self-repairing electromagnetic shielding repairing putty and preparation method

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preparation example Construction

[0028] According to a typical embodiment of the present invention, a method for preparing the above self-healing microcapsules is provided. The preparation method comprises the following steps: mixing and reacting graphene oxide and wall material raw materials to prepare a wall material prepolymer; preparing a dispersion of allyl methyl disulfide grafted epoxy resin, and then adding a dispersant, carbon nano The tube and the emulsifier form an oil-in-water emulsified solution, that is, the core material; and pour the core material into the wall material prepolymer, add a water-resistant modifier, adjust the pH value to 2.5-3.5, and heat up to 55-65C for reaction, preferably at 60° C. to obtain a suspension of microcapsules, which is washed, filtered and dried to obtain self-healing microcapsules. Typically, the wall material raw materials are urea and formaldehyde; preferably, the wall material raw materials also contain carbon nanotubes and dispersants. The water resistance ...

Embodiment 1

[0034] 1 Preparation of microcapsule wall material prepolymer

[0035] Weigh 25g of urea and 50ml of formaldehyde aqueous solution into a three-necked flask, stir and dissolve, add 15ml of graphene oxide dispersion with a concentration of 20g / L, stir ultrasonically for 30min, adjust the pH of the solution to 8-9 with triethanolamine, The temperature was raised to 65°C for 1 hour to prepare a conductive wall material prepolymer.

[0036] 2 Preparation of intrinsic self-healing core material emulsion

[0037] Take by weighing 6g sodium dodecylbenzene sulfonate, be dissolved in 100ml deionized water, obtain the emulsifier with water-phase oil-phase double group; Get 30g epoxy resin and dissolve with n-butanol, join in the place that thermometer is housed, stir Add the initiator dibenzoyl peroxide with 2% mass fraction of epoxy resin to the four-necked flask of condenser and condenser tube, raise the temperature of the system to 90-100°C, slowly add 10% mass fraction of epoxy res...

Embodiment 2

[0045] 1 Preparation of microcapsule wall material prepolymer

[0046] Weigh 25g of urea and 50ml of formaldehyde solution into a three-necked flask, stir and dissolve, add 30ml of graphene oxide dispersion with a concentration of 20g / L, 1g of carbon nanotubes and 0.2g of dispersant, and ultrasonically stir for 30min. Ethanolamine adjusts the pH of the solution to 8-9, and raises the temperature to 65° C. for 1 hour to prepare a conductive wall material prepolymer.

[0047] 2 Preparation of intrinsic self-healing core material emulsion

[0048] Take by weighing 5g sodium dodecylbenzene sulfonate, be dissolved in 100ml deionized water, obtain the emulsifier with water phase oil phase double group; Get 30g epoxy resin (127 epoxy resins and 1564 epoxy resins by weight 1:1 mixture) is dissolved with n-butanol, joins in the four-necked flask that thermometer, stirrer, condenser are housed, then adds the initiator dibenzoyl peroxide of epoxy resin quality 2%, the system temperature...

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Abstract

The invention discloses a self-repairing microcapsule, self-repairing electromagnetic shielding repairing putty and a preparation method. The self-repairing microcapsule comprises a capsule wall and a core material, wherein the capsule wall is composed of a conductive wall material containing graphene oxide; the core material is repairing liquid containing allyl methyl disulfide grafted epoxy resin. The self-repairing microcapsule with conductivity prepared by the invention is used as a shielding filler, so that the electromagnetic shielding putty can realize good electromagnetic shielding performance and self-repairing function only by virtue of the self-repairing microcapsule with conductivity without adding a conductive filler, and the putty has the advantages of external assistance type and intrinsic type self-repairing materials; and generated cracks can be repaired for multiple times.

Description

technical field [0001] The invention relates to the technical field of coatings, in particular to a self-repairing microcapsule, a self-repairing electromagnetic shielding repair putty and a preparation method. Background technique [0002] In recent years, with the rapid development of the electronic information industry, various electronic and electrical equipment have provided great help for people's daily life and social construction. At the same time, the electromagnetic radiation and interference problems generated by electronic and electrical equipment in the working process also restrict people's production and life, resulting in increasingly serious electromagnetic pollution in human living space. The fourth most polluted after pollution. Electromagnetic waves of various frequency bands in space seriously affect human health and the normal work of communication equipment. Therefore, it is necessary to find a way to cut off the propagation path of electromagnetic w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J13/14C09D5/34C09D5/24
CPCB01J13/14C09D5/34C09D5/24
Inventor 刘若鹏赵治亚贺栋培
Owner LUOYANG INST OF CUTTING EDGE TECH